Electronics Forum | Mon Feb 12 01:19:27 EST 2007 | Wayne
the center part of the BGA balls may not fully reflow or melt and cause BGA tilt, not functioning working (only press then work) and etc..... the simple way to solve this issue is to use low temperature solder paste, it can melt in between 220 to 225
Electronics Forum | Thu Apr 20 02:44:39 EDT 2017 | tsvetan
The hole is too big, you should reduce the size in the next PCB revision. The middle joint is soldered at low temperature you can see how the solder didn't distributed evently and cooled on waves. The solder joint at the bottom didn't wet the capac
Electronics Forum | Wed Jun 17 05:41:04 EDT 2020 | SMTA-Davandran
I have one product which only need print low temperature solder paste on OSP pad. This pad will used for hot bar process. Desired solder paste thickness is 0.10 mm to 0.15 mm. Is any one can advise right stencil thickness and aperture opening for it.
Electronics Forum | Thu Dec 23 12:31:37 EST 2021 | proceng1
I just learned of this and can only find a very small amount of information, and only from one source. I'd like to understand more. Also, they only seem to talk about low temperature PCB like flex. Does it work on FR4?
Electronics Forum | Tue Dec 29 20:35:29 EST 2020 | davef
Alcohol Content: Ionographs don't like to have the alcohol content too far off from 75%. If that happens, either way, your resistivity will be low. Temperature: Ionographs don't like to be rushed. Stay focused on a proper warmup time. If you don't,
Electronics Forum | Fri Jul 23 08:59:27 EDT 2004 | davef
For reflow, low soak time and low peak temperatures will help reduce the number of components skewing Search the fine SMTnet Archives. For instance: http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=6071&mc=15
Electronics Forum | Tue Dec 28 09:45:03 EST 2004 | davef
Assuming the poor hole fill is not localized, try: * Inadequate preheat * Flux specific gravity is low * Low solder temperature * Conveyor is running too fast * Solder pot is contaminated
Electronics Forum | Tue Mar 07 21:14:46 EST 2000 | Doug Kennedy
Russ, I don't understand this thread in general...Got three APE Chipmaster's and one Chipper running 24/7 and have never had a problem....it's been almost three years. What are you doing with your Chipmaster? What chips? It's rare that we hav
Electronics Forum | Tue Mar 07 21:14:46 EST 2000 | Doug Kennedy
Russ, I don't understand this thread in general...Got three APE Chipmaster's and one Chipper running 24/7 and have never had a problem....it's been almost three years. What are you doing with your Chipmaster? What chips? It's rare that we hav
Electronics Forum | Fri Nov 25 14:52:50 EST 2011 | davef
Sn43/Pb43/Bi14 is a low temperature leaded alloy that has been used with very good success. The low melting point helps avoid some thermal shock issues on some assemblies. A word of caution, this alloy forms a low melting point at approximately 95*C.
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