Electronics Forum | Fri Oct 03 07:49:18 EDT 2003 | mk
Mask Musings. Soldermask (SM) and its functions have changed and evolved over the years. As an ex-solder mask applicator, I can remember screening Colonial High Gloss Epoxy soldermask on boards back in the early 80's, ending up with a thickness that
Electronics Forum | Thu Jun 15 12:57:12 EDT 2000 | Dave F
0.0006" LT Total pad height = Thickness of ( Copper pad + OSP ) = 0.0014" + 0.00000157" = ~0.0014" (You must be using an organic solderability preservative (OSP) or Electroless Nickel immersion gold (ENIG) because 0.003" tin/lead or white tin would
Electronics Forum | Mon Jul 01 16:15:02 EDT 2002 | Matt Kehoe
We are currently trying to gather information pertaining to applying LPI soldermask thicker than normal. The thick coating is necessary for the SIPAD ssd process however, because of the numerous brands of mask and application methods there is no sing
Electronics Forum | Wed Mar 03 17:09:55 EST 1999 | Tom Reilly
We have recently had problems with bare boards coming in too thick. I would like to know how to properly specify the minimum and maximum thickness using the 13949F and IPC 4101 specs. (We currently use "MATERIAL: GFN 0620 C1/C1 A2A per MIL - P - 1394
Electronics Forum | Wed Mar 03 20:20:30 EST 1999 | Earl Moon
| We have recently had problems with bare boards coming in too thick. I would like to know how to properly specify the minimum and maximum thickness using the 13949F and IPC 4101 specs. (We currently use "MATERIAL: GFN 0620 C1/C1 A2A per MIL - P - 13
Electronics Forum | Thu Sep 19 02:45:33 EDT 2002 | bugsjoe
Thank you ur reply Dave. Let me explain our COB workflow: 1. unpack PCB (FR4,LPI,HASL)(the thickness of gold and nickel we can't be find)(No SMT before) 2. clean the pcb by rubber 3. blow the pcb by di-ionic gun 4. attach die by adhesive gel 5. cure
Electronics Forum | Tue Dec 11 22:31:40 EST 2001 | davef
I'd be surprised if solder mask color is causing your delamination. We use various solder mask colors on FR4 boards and notice no difference. * ~99% of our boards are a medium green * ~1% of our boards are dark green * One of our boards is caramel b
Electronics Forum | Mon Jul 01 20:45:38 EDT 2002 | davef
Solder mask thickness specifications by fabricators are: * Wet mask: 0.0002 ~ 0.0004� on trace * LPI mask: 0.0002 ~ 0.0008� on trace Liquids usually range between 10 to 13 um (0.00039 to 0.00051") when dried. Liquid resist processes I have seen are
Electronics Forum | Wed Sep 18 22:53:24 EDT 2002 | davef
Please give us background on your situation, so that we can focus on the specifics, for instance: * This is a bare board problem, correct? Then, this contamination causes what the problems in your process? * What is the type [ie, FR4, CEM1, etc] of
Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
