Electronics Forum: lumonics and laser (Page 5 of 6)

Step down stencils using CBGA and 20 mil QFP's

Electronics Forum | Thu Oct 21 14:02:32 EDT 1999 | Ron Costa

We are a contract manufacturer currently building a job with IBM CBGA-255 devices and 20mil QFP's that are close to each other. We use a 6 mil laser cut and electro polished stencil with one to one apertures on the BGA's. The customer is experiencing

IPC Class 3 Annular Ring and Fine Pitch BGA Challenges

Electronics Forum | Fri Sep 08 21:49:24 EDT 2017 | sbar5781

Hello, I have a few PCB boards i am trying to be manufactured that are miniaturized medical devices. Thus they require IPC Class 3 Specs. However as miniature devices they have limited space, including a 0.4mm pitch BGA socket, which currently has

Pick and Place Startup - LQPF100 bridging issues

Electronics Forum | Thu Mar 25 23:23:00 EDT 2021 | llawrence

The QFP pitch is 0.5mm. Pad size is 1.475 x 0.3mm, and the new aperture size is 1.32 x 0.22mm. I'm not sure about whether or not it is lasered, but on the newly ordered stencil I selected the polishing option. Looks like the pad width is already 2/3

Re: paste release from stencil, and volume calculation

Electronics Forum | Sat Nov 13 14:09:45 EST 1999 | se

First, let me say what I always say: a good chem-etched stencil will print fine pitch. Chem-etch brings trap to the side walls because its a physical by-product of the process. Because they are less expensive you can add electropolish and still save

Line release of post reflow AOI and AXI

Electronics Forum | Mon Sep 22 17:02:58 EDT 2008 | hegemon

You are on the right track Ismir. Essentially however, as the programmer of the machine, I am the one that creates the PCB with the errors to benchmark the settings for the machine. No secret lab though! :-) Easy enough for most any AOI machine to

Poka yoka tool for assembly of chip capacitors and resistros

Electronics Forum | Mon Sep 08 11:38:52 EDT 2014 | spoiltforchoice

They key requirement before any fancy tools is careful storage, stock control, labeling and handling. If your parts are incorrect before they even get to production, you're screwed. As gregp suggests, to get consistently correct value and orientation

Possibility of a cheaper pick and place machine design?

Electronics Forum | Thu Sep 11 10:01:30 EDT 2014 | spoiltforchoice

1 - Too messy, parts already come in nice easy to use machine compatible packaging, tapes, reels, tubes and trays. All you are doing is adding an extra step and complication. A key production aim is to reduce the number of steps. 2 - BGA - a chip wi

Re: Adhesive Dispenser Vs. Screen Printing Adhesives Pros and Cons

Electronics Forum | Thu Oct 12 22:16:59 EDT 2000 | Dreamsniper

Hi Guys, I'd like to share this to all of you...you can start playing with the rests...Stated prices, if not indicated, are in Aussie $ or Singapore $. Stencil Printing Adhesive Pros a) Less Capital Equipment Cost (Short Term). In reality it is f

Best solder paste printer with solder paste inspection and AOI function-Recomendation

Electronics Forum | Wed May 25 18:30:11 EDT 2022 | stephendo

And laser diode reflow soldering as well!

How important NSMD pads are for the QFN and similar packages?

Electronics Forum | Thu Jul 31 10:14:27 EDT 2014 | matusov

I know that some board houses have better > capability than others. Some can do down to 4mils > mask in between the leads I think. I know that it > also depends on the type of the mask they are > using - for some types you can't go down to the >


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