Electronics Forum | Tue Jan 21 06:53:05 EST 2020 | ameenullakhan
Dear Experts, Need your suggestion on the minimum tension to be maintained in the SMT stencil. Presently we are maintaining the 30 - 50 N/cm2 at the 4 corners of the stencil. And not considering the center of the stencil into consideration.. Is t
Electronics Forum | Wed Jan 22 03:46:07 EST 2020 | SMTA-Davandran
Same practice is maintain at my organisation but include center during each set up. This practice is to ensure that stencil is in good during production since no standard for stencil life span control.
Electronics Forum | Tue Jan 21 09:11:51 EST 2020 | emeto
What does supplier say?
Electronics Forum | Sun Feb 23 21:50:08 EST 2020 | sssamw
Read 35-55 @ 5 position, 4 corner and 1 center.
Electronics Forum | Tue Mar 03 06:24:05 EST 2020 | ameenullakhan
Dear All, thanks a lot . Supplier recommend same 35 - 50 n/cm. But our customer is asking for any standard available in the industry to follow same. Please share any standard . If come across. Regards, Ameen
Electronics Forum | Wed Mar 04 02:51:48 EST 2020 | SMTA-Davandran
I got question on is there any variance for thickness of stencil with respect to stencil tension. Is ther any guideline for it.
Electronics Forum | Thu Mar 05 02:48:24 EST 2020 | majdi4
The tension depends on the thickness of the stencil. Exp: stencil of 100µm => tension must be higher than 33N
Electronics Forum | Fri May 29 05:43:05 EDT 2020 | ameenullakhan
Hi Team, what we have observed is that tension basically at the center of the stencil is less . And it directly depends on the number of aperture opening we have . More the opening less the tension. But there is no supporting document for the same
Electronics Forum | Thu Jul 28 14:13:52 EDT 2005 | rsmith@z-mar.com
It is important that the ESDS device, the operator, and the work surface maintain the same elctrical potential. ESD events take place when objects of different electrical potentil come in contact with each other. When these different charges equalize
Electronics Forum | Tue Nov 30 02:46:21 EST 2010 | libandara
We want to handle the materials such as PCB & MSD components as per IPC 1601 & J-STD-033. As such, we need a baking oven to perform this and to monitor (temperature – we have to maintain up to 200’C & humidity – below 5%)the control environment & ma
