Electronics Forum | Mon Feb 15 17:57:01 EST 1999 | Earl Moon
| Hope some of you out there can help me with this one. | I am getting feedback from our test department that they are showing opens on solder joints which have visually good wetting. The touch-up operators confirm that the joint looks good. All they
Electronics Forum | Wed Feb 10 00:07:15 EST 1999 | Jason
Gary, I am also evaluating MRP/ERP systems. I have had many demos. I have looked at SAP R3, and actually used it at a previous employer, very complex system and a bit pricey. SAP is at http://www.sap.com , others I have looked at are Acacia Tech
Electronics Forum | Wed Feb 10 07:01:49 EST 1999 | Joe
We use both F4G and MCS at the present and we are phasing out MCS. One main reason is that it's platform is not Y2K compliant. F4G is cumbersome and taxes a high overhead on your computer system. We have also found a bug recently when we have high
Electronics Forum | Wed Feb 03 18:36:47 EST 1999 | Earl Moon
| Does anyone know if I will have problems soldering surface mount components to an all hard gold plated PC board. We want to use hard gold similar to gold used for edge fingers because our customer is concerned about wear and conductivity of connect
Electronics Forum | Tue Feb 02 11:07:36 EST 1999 | justin.medernach@flextronics.com
| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r
Electronics Forum | Mon Jan 25 20:53:03 EST 1999 | Earl Moon
| Greetings, | | Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. | Also, is there any danger of the pcb's giving off some kind of gas or vapour which can b
Electronics Forum | Tue Jan 26 19:30:36 EST 1999 | Nik
| | Greetings, | | | | Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. | | Also, is there any danger of the pcb's giving off some kind of gas or vapour whi
Electronics Forum | Tue Jan 26 23:05:30 EST 1999 | Thomas Clift
| | | Greetings, | | | | | | Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. | | | Also, is there any danger of the pcb's giving off some kind of gas or va
Electronics Forum | Wed Jan 27 06:29:55 EST 1999 | Earl Moon
| | | Greetings, | | | | | | Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. | | | Also, is there any danger of the pcb's giving off some kind of gas or va
Electronics Forum | Sun Jan 24 19:53:54 EST 1999 | Steve Gregory
| It has been known that sufficient cooling after soldering is important in order to get a stronger joint during its solidification stage. And it has been so much emphasised with reflow oven. But, why many models of wave soldering machine do not come
