Electronics Forum | Tue Jun 09 12:39:47 EDT 1998 | Dave F
| | Hello, | | Some time ago before I was an engineer the company that I work for now made it a company policy to not allow hot air leveling for reasons that I do not know about yet. All I know that this policyt agreed with the MIL standards at the
Electronics Forum | Tue Jun 09 13:08:30 EDT 1998 | Earl Moon
| | | Hello, | | | Some time ago before I was an engineer the company that I work for now made it a company policy to not allow hot air leveling for reasons that I do not know about yet. All I know that this policyt agreed with the MIL standards at
Electronics Forum | Wed Jun 03 09:04:19 EDT 1998 | Steve Gregory
Hi Anthony! Earl's right, things can get rather involved when you start discussing ALL the things that affect whether or not a board is going to warp. The way I look at the issue is try to separate the warp issue into two catagories; 1. The board bei
Electronics Forum | Sat May 30 18:33:02 EDT 1998 | Earl Moon
This message is to Cunli and his great staff who keep us flying straight and level while reminding us always to keep our nose down in the turns. (can't keep from doing some of that pilot "s__t" Mav. I, I mean we, would like to post some tempters as a
Electronics Forum | Mon Jun 01 09:32:29 EDT 1998 | Dave F
| This message is to Cunli and his great staff who keep us flying straight and level while reminding us always to keep our nose down in the turns. (can't keep from doing some of that pilot "s__t" Mav. | I, I mean we, would like to post some tempters
Electronics Forum | Sat May 30 18:09:17 EDT 1998 | Earl Moon
| Got handed an assignment for which I'm not totally qualified. Don't expect this forum to had me all the answers. Some answers are obvious as the device types are fairly self explanatory. | As everyone knows, IBM had problems with their ceramic BGA
Electronics Forum | Mon Jun 01 20:37:54 EDT 1998 | D.Lange
| | Got handed an assignment for which I'm not totally qualified. Don't expect this forum to had me all the answers. Some answers are obvious as the device types are fairly self explanatory. | | As everyone knows, IBM had problems with their ceramic
Electronics Forum | Wed May 27 16:02:32 EDT 1998 | Chrys
| We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not localized to
Electronics Forum | Wed May 27 14:20:43 EDT 1998 | Earl Moon
| We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not localized to
Electronics Forum | Fri May 29 17:07:00 EDT 1998 | Dave F
| | We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not localized
