Electronics Forum | Tue Sep 07 22:15:26 EDT 1999 | NAZEEH CHAUDRY
| | | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | | these machines dont even offer bga selections. These mac
Electronics Forum | Tue May 19 06:57:33 EDT 2009 | cunningham
whats the reason for the underfill? we dont underfill any of our BGAs rework could be a issue if they need to be replaced? tried DP190?
Electronics Forum | Mon May 18 08:59:41 EDT 2009 | ozgurv
Dear All, Does anyone on the forum have experience with underfilling process of bga? We have a component with 0.5mm bga on one of the new products. Customer wants this component to have an underfill. Questions - 1) which kind of epoxy or chemica
Electronics Forum | Fri Mar 19 10:02:44 EDT 2010 | karlo
There is a wide range of BGA underfills to satisfy specific needs. Some are designed for those who place a premium on high speed, high volume processing, shock or drop test perforamnce, and ease of reworkability. Others are designed for those who p
Electronics Forum | Tue May 19 08:20:10 EDT 2009 | Mity C
Good Morning, We are underfilling some of our BGA's. This is a specified customer requirement. The material we are using is Emerson & Cuming E-1216 (also specified by the customer) The material was selected because of a close CTE match with the PCB.
Electronics Forum | Fri May 22 16:00:54 EDT 2009 | pjc
Henkel- Hysol seems to be the most popular material that I see: http://www.henkel.com/cps/rde/xchg/SID-0AC83309-B331D246/henkel_com/hs.xsl/12169_20090505-henkel-launches-next-gen-underfill-20681_COE_HTML.htm As far as application method, its all ab
Electronics Forum | Tue Sep 09 15:07:04 EDT 2008 | ksrsr
We bake before we replace our BGA's for at least 12 hours at 125C.
Electronics Forum | Tue Sep 09 16:00:07 EDT 2008 | ppcbs
We always bake our loaded boards before any BGA rework is done. 12 to 16 hours at 100 c. We have had incidents in the past on loaded boards where 125 c has melted parts and the occasional low temp BGA trays. 100 c has proven safe for the past 10 y
Electronics Forum | Wed Sep 03 16:52:22 EDT 2008 | phongng_99
Hi, Do we need to bake the board before doing the BGA replacement (not reball process). Thanks Phong Nguyen
Electronics Forum | Thu Sep 04 06:58:46 EDT 2008 | davef
If you plan to reuse the BGA, you probably should bake the moisture from the component prior to removing it from the board.
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