Electronics Forum | Thu Sep 22 16:06:07 EDT 2011 | davef
Underfilling BGA is an uncommon practice. We'd start looking to find a consultant recommended by our: * Dispenser company * Underfill supplier
Electronics Forum | Thu Sep 22 14:54:01 EDT 2011 | hegemon
You might find a lot of experience in the forum here, but maybe not so many consultants for this niche. BGA underfill is not rocket science, and in my opinion, the key items are the material chracteristics, and the dispensing method and pattern. Fo
Electronics Forum | Tue Sep 20 08:53:13 EDT 2011 | jocelynlauzon
My company is looking for an IPC expert consultant in BGA underfilling to support an important contract that is being prepared. We are looking for someone with hands-on experience with large (~2"x2", with as much as 1800 pin, 1mm pitch, 0.5mm ball di
Electronics Forum | Fri Mar 19 10:02:44 EDT 2010 | karlo
There is a wide range of BGA underfills to satisfy specific needs. Some are designed for those who place a premium on high speed, high volume processing, shock or drop test perforamnce, and ease of reworkability. Others are designed for those who p
Electronics Forum | Mon May 18 08:59:41 EDT 2009 | ozgurv
Dear All, Does anyone on the forum have experience with underfilling process of bga? We have a component with 0.5mm bga on one of the new products. Customer wants this component to have an underfill. Questions - 1) which kind of epoxy or chemica
Electronics Forum | Tue May 19 08:20:10 EDT 2009 | Mity C
Good Morning, We are underfilling some of our BGA's. This is a specified customer requirement. The material we are using is Emerson & Cuming E-1216 (also specified by the customer) The material was selected because of a close CTE match with the PCB.
Electronics Forum | Fri May 22 16:00:54 EDT 2009 | pjc
Henkel- Hysol seems to be the most popular material that I see: http://www.henkel.com/cps/rde/xchg/SID-0AC83309-B331D246/henkel_com/hs.xsl/12169_20090505-henkel-launches-next-gen-underfill-20681_COE_HTML.htm As far as application method, its all ab
Electronics Forum | Fri Jun 08 07:52:13 EDT 2007 | zanolli
We are looking at a specialized method of direct soldering ceramic circuit modules (maybe 40mm square) to a mother board with solder joints on only 2 of the 4 sides. These modules would be oriented horizontally, or mezzanine like, to the mother board
Electronics Forum | Tue Sep 07 22:15:26 EDT 1999 | NAZEEH CHAUDRY
| | | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | | these machines dont even offer bga selections. These mac
Electronics Forum | Wed Mar 27 18:23:01 EST 2002 | kmorris
Does anyone have experience doing conformal coating over Plastic BGA in High-Rel PCB assembly? Is underfill necessary to avoid problems with entrapped air, etc? Our application is a 17x17mm BGA, 256 I/O. We are assembling with a water soluable pas
