Electronics Forum: manual soldering validation check sheet (Page 1 of 1)

First piece PCBA validation

Electronics Forum | Tue May 31 16:52:57 EDT 2011 | xray

Hi SSager, Check out the FA Inspector. It provides 1 Automatic Detection Mode and 2 Manual Inspection Modes. Its used to automate First Article Inspection Tasks and enhance today's principally manual process using microscopes and pen and paper. T

THT manual assembly worker instructions

Electronics Forum | Tue Feb 26 17:00:15 EST 2008 | slthomas

I haven't had the luxury of machine based pth assembly in quite a while, but when I did, given that the machines control which parts are inserted (and to a lesser degree where they are inserted) we decided not to perform inspection on that part of th

QFN soldering

Electronics Forum | Mon Nov 12 09:37:17 EST 2007 | russ

You need to perform process a capability study prior to putting these controls into place. Cleaning a stencil after each pass will get ugly, solvent residues remaining in apertures etc. 2D inspection is good. Change paste every hour will get very

How to prevent BGA issue of SMT solder resist when fabricate PCBA

Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3

To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads

Re: DFM / DFT information

Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F

=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so

Solder Balls in Boards

Electronics Forum | Sat Jun 12 00:34:00 EDT 2004 | kanwal324

Hi ! The main problem being faced currently is formation of solder balls - to be precise, these are micro solder beads generally found attached with bodies of SOTs, Chip Caps, Chip Resistors, between pins of SOICs (50 mil) - lying on PCB surface,

AXI and AOI

Electronics Forum | Tue Jul 09 15:20:19 EDT 2002 | pjc

When you look at the capabilities of Combo machines they tend to sacrifice performance when compared to separate X-ray and AOI machines, meaning they don't do either the X-ray or AOI operations as well as a machine that was designed to do only one. A

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