Electronics Forum: material flow control (Page 1 of 67)

No flow underfills

Electronics Forum | Thu May 01 09:26:53 EDT 2008 | scottp

Voiding was also the issue I had. I could reduce them substantially by pre-baking the boards, but that's obviously not desirable. Hopefully the chemists have come up with a solution. I extruded some pretty cool looking solder shorts through the vo

Reball BGA process flow

Electronics Forum | Wed Feb 02 13:05:51 EST 2005 | russ

Process flow 1.Remove part - It may be necessary to bake assembly prior to removing. 2.Remove remaining solder from part 3.Apply flux to part 4.Apply solder spheres to part 5.Reflow part You may want to bake component before re-installing 6.Apply

Compressor air line material

Electronics Forum | Sat Jun 23 11:35:58 EDT 2007 | grantp

Hi, Yes, we just built a new plant, and used copper again. The stuff we cut out of the old building was copper, and it was fine without any issues. We lay it on an angle so condensation flows to an end, and can be periodically vented, and we take a

Compressor air line material

Electronics Forum | Mon Jun 25 10:42:43 EDT 2007 | fredc

On our new shop we used iron pipe in the walls and attic and copper ever where else that can be easily accessed. I saw a pvc material at a trade show years ago that was rated for air lines. With their demo material they could fold it and drive nails

SMT control management software

Electronics Forum | Mon Jun 29 06:57:13 EDT 2015 | jlawson

Valor MSS has options for NPI Data preparation and processing, SMT programming, documentation, verification, materials management, traceability, and QA management not just in SMT but into backend process aka manual assembly as well as production plan

Profile control parameters

Electronics Forum | Tue Jan 21 11:03:15 EST 2003 | MA/NY DDave

Hi You already received good answers. A thing to remember is the components and the PCB. How high you go above 63/37's 183C should be limited to create a good solder joint. Too long creates problems since the components and the PCB start to be he

Static control for shelving

Electronics Forum | Fri Aug 08 15:30:50 EDT 2003 | bman

Hello all, I'm working at a CM with less then ideal material storage shelving when it comes to ESD protection. I've got ordinary painted shelving units that I need make ESD safe. I'm considering dissipative mats or spray coatings for each shelf, t

Solder paste control

Electronics Forum | Fri Nov 11 04:40:18 EST 2005 | pavel_murtishev

Good day, First of all used solder paste should be placed in special container. It should be kept separately from �fresh� solder paste from the same jar. Limit paste usage period after opening the jar according to manufacturer�s specification. When

Static control for shelving

Electronics Forum | Fri Aug 08 19:03:08 EDT 2003 | scott

Hello all, > > I'm working at a CM with less then > ideal material storage shelving when it comes to > ESD protection. I've got ordinary painted > shelving units that I need make ESD safe. I'm > considering dissipative mats or spray coatings

Solder flow thru via on pad

Electronics Forum | Tue Sep 25 14:08:59 EDT 2001 | davef

Oooo, the solder on the pad and PGA ball is flowing during reflow down the via to the secondary side? Why didn�t you say so?? ;-) Why would you expect that gravity and capillary action wouldn�t force solder to flow down the solder plated via to the

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