Electronics Forum | Tue Aug 22 13:04:04 EDT 2000 | Eugene Smelik
Dr. Lee, Given the higher reflow temperatures for Pb-Free assembly, will common FR4 laminate materials be adequate, or do you believe that higher glass content boards will be required for mainstream Pb-free assembly? As a corollary question - if man
Electronics Forum | Fri Aug 27 06:29:24 EDT 2004 | Snehal Acharya
Hi to All, Can any one tell me about the good books on Reflow profile & printing process (author + publication + price)which is readily available in india. regards, snehal acharya.
Electronics Forum | Fri Aug 27 11:57:49 EDT 2004 | Dreamsniper
REFLOW SOLDERING PROCESSES AND TROUBLESHOOTING: SMT, BGA, CSP AND FLIP CHIP TECHNOLOGIES By Ning Checng Lee http://www.argospress.com/Resources/business/book-0750672188.htm regards,
Electronics Forum | Fri Aug 27 15:00:42 EDT 2004 | davef
Dr Lee's book mentioned above is very good. Also consider: IPC-7530 - Guidelines for Temperature Profiling for Mass Soldering (Reflow and Wave)
Electronics Forum | Tue May 23 09:12:27 EDT 2000 | Gabriele Stefanini
Hi everybody, I'm an engineering student and I'm looking for material about inert reflow (such as websites, papers ...). Please help me!
Electronics Forum | Tue Feb 19 09:24:25 EST 2019 | cyber_wolf
Reflow profiles are based on the product and materials you are soldering. You need profiling software and a data logger.
Electronics Forum | Fri Jan 22 08:25:18 EST 2010 | davef
This socket supplier never expected you to do what you're doing to his/her part. Some materials bear-up under the thermal strain of reflow solder than others. Try different socket materials.
Electronics Forum | Wed Apr 08 11:05:53 EDT 2009 | boardhouse
Hi, Need a little more info, 1) this board is definitely delaminated 2) this board looks like a Std FR4 board with 63/37 Hot air finish with probably 140 tg. material. Was this reflowed under lead free temps? 3) Do you Pre-bake product 4) What
Electronics Forum | Tue Oct 07 22:15:12 EDT 2014 | padawanlinuxero
How to avoid /reduce warpage in long length PCB & > _1.6MM THICK PCB. You need to put it in a fixture or pallet to run it in the reflow oven, most common material use here is durostone for the pallets that we run in the reflow oven, we use Durosto
Electronics Forum | Wed Apr 08 11:33:51 EDT 2009 | 1036
2) STD FR4 material with HASL finish, 4 layer board. Reflowed under tin-lead temps with another 4 layer board same time(no delamination problem). 3) We uasualy do not pre-bake board unless board is too old. 4) We do not have the board on hand right
