Electronics Forum | Fri Aug 05 09:37:11 EDT 2011 | rgduval
From the fine SMTNet archives: http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=12824&#Message54659 There are a few other threads available, as well, by searchign on PCB Delamination. Delamination post reflow is almos
Electronics Forum | Thu Jan 21 09:55:14 EST 2016 | Sam
We are running a project that is 5 years old. We have yet to resolve all of the issues. Out biggest is warping due to the board being .012" thick. We have created a custom pallet (ricocel) and pallet cover (FR4) to sandwich the board but I am afraid
Electronics Forum | Mon Aug 29 21:36:39 EDT 2011 | davef
We agree with JAX. Changing the pads on your board as you describe won't do shit. Possible solutions to a cold solder connection problem include: * Raise the peak temperature to be high enough to reflow the material thoroughly. * Select a solder pas
Electronics Forum | Thu Aug 22 22:19:13 EDT 2019 | sssamw
From the picture you present, it is a pin in paste part with pin length 2.2mm (a good length for 1.6mm PCB thickness), and seems the pin tilted and touch on PCB surface, thus causes up-part. Sorry I cannot image pin tilted not before placement but i
Electronics Forum | Mon Jun 18 14:35:40 EDT 2018 | davef
That's a reasonable question for a supplier to ask his / her customer. It depends ... It depends on the materials use in the process the assembly and the reflow temperature recipe
Electronics Forum | Thu Jan 30 10:12:00 EST 2020 | emeto
More detail Jinesh. Profile, datasheet of the part, stencil design, PCB finish, soldering material. Initially I am assuming you use pallet to reflow 0.2mm thick board.
Electronics Forum | Tue Jul 11 10:13:22 EDT 2006 | SWAG
Over time, you might see problems with delam., blistering and warpage if using FR4 carriers. Depending on volumes, you might consider using durostone or some robust material like that for the production runs. Keep in mind that switching materials w
Electronics Forum | Fri Sep 11 17:23:00 EDT 1998 | Eric Miller
Hey Dave, sounds like your material is delaminating at a rapid rate, I would not recommend using them through your process, delaminating material has to go some where! When composite material is made, layers of fibre glass and epoxy resin are placed
Electronics Forum | Tue Nov 28 10:48:29 EST 2017 | georgetruitt
Some things to look into are the component finish, material and composition of the solder, design of the smt stencil, reflow profile or process atmosphere (N2 or air)also contribute to the solder result. The influence of the PCB itself should be co
Electronics Forum | Wed Jan 22 09:59:28 EST 2003 | Juan C. Ruiz
I would like to know how to decide what to use: a batch oven or a conventional reflow oven to cure an underfill material that require 20 min@150 C. the size of the board is 50 X 100 mm. Cycle time previous to cure is 2 minutes. The lenght of the refl
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