Electronics Forum | Mon Sep 10 02:47:27 EDT 2001 | Peter W.
Thank you for your annotaions. I am aware of the limits and temperatures of that material, but we are doing some research with thermoplastic base materials which won't survive standard solder paste reflow soldering. And beside of using conductive ad
Electronics Forum | Mon Mar 21 02:51:23 EST 2005 | amstech
I have done few thermocouples using high lead solder, silver epoxy that is used for die attach purposes and some X - non conductive material. Though all materials show a slight variation in temperatures (3 to 5 degree C), the dwell time at peak is qu
Electronics Forum | Fri Jun 17 23:31:12 EDT 2005 | kenscj
Hi all, currently, we are seeing BGA problem like solder ball misalign, void, solder short (all under BGA, tested with 5DX), after reflow. We examine the solder ball (raw material of BGA), and see that the ball surface is not smooth, will that affe
Electronics Forum | Thu Apr 07 14:31:08 EDT 2022 | SMTA-69080803
I'm looking for a double-sided adhesive solution: 1. Strong or permanent adhesion on one side, temporary adhesion on the other side. 2. Can withstand high temperature (lead-free oven reflow) I'm trying to temporarily stick material on a panel using
Electronics Forum | Thu Jul 06 12:31:25 EDT 2017 | bmedeiros2017
Hello, Curious to know if anyone has had some experience converting a Heller reflow oven to Cure 1B73 Coating material. Please share experience and process parameters to help obtain cure to conformal coated boards. TIA!!!
Electronics Forum | Wed Jun 04 10:51:28 EDT 2014 | clydestrum
Well, we cannot make the cuts any deeper as then we would incur a significant amount of "bowing" at SMT placement/reflow. -Has anyone ever heard of changes in material/laminate makeup that causes this? A sort-of stronger, or more flexible tensile st
Electronics Forum | Fri Jun 27 08:41:40 EDT 2014 | hungikuo
Is it safe to let Au80Sn20 reflow twice? What I am saying is, for example, die attach using Au80Sn20, followed by lid seal using same Au80Sn20 solder, will it create any problem on the die which was first attached using same soldering material? My
Electronics Forum | Tue Oct 24 09:52:35 EDT 2006 | SWAG
We are having the exact same problem! We do about 6 or so ROHS SMT builds. 5 are fine now but we had problems with most initially and 1 is trouble still. All boards are same material, same PCB manufacturer. Initially, when the delam. problem occu
Electronics Forum | Tue Jun 12 20:36:00 EDT 2001 | ianchan
Hi mates, thanks for the interest on this topic, just to share info to clarify any queries : 1) am using light blue-grey materials for the Pallet 2) am using Hot Air Convection Reflow Oven 3) I suspect its due to the Pallet materials properties, t
Electronics Forum | Thu Jul 22 17:39:58 EDT 2021 | proceng1
We do use a company for custom fixtures, but we also make some in house. The biggest hurdle for a board that requires a fixture to go through printing and SMT is that the board has to be the tallest thing. So any hold downs or locating hardware has
