Electronics Forum | Wed May 17 20:37:08 EDT 2000 | Steve
At our facility, we process FR-4 boards for PCMCIA cards (0.020"). The key for us is dedicated fixturing for stencil printing and fixturing for reflow soldering. We are working closely with our customer to better improve panel design, but other than
Electronics Forum | Thu Aug 24 16:54:33 EDT 2000 | Dr. Ning-Cheng Lee
52In/48Sn solder has a melting point 118C, and can be reflow processed at temperature down to around 165-170C. The material is very soft, very low in shear strength. It is relatively ductile, can be stretched to about 2-3X of Sn63 in elongation. Amon
Electronics Forum | Wed Oct 04 14:46:46 EDT 2000 | Kal. Chak.
Hi folks, What are the differences between Epoxy resin(ER)conformal coating and adhesive stacking/bonding material? My PSA/PRA (Post solder/reflow assembly)bracket assembly process got some ER adhesive encroachment on pads/solderjoints. I have chec
Electronics Forum | Thu Oct 07 07:58:29 EDT 2010 | scottp
The problem is there are also studies showing reduced reliability. Early thoughts were that if you got complete reflow of both solder materials then you'd be fine, but several studies have shown that there's something going on that's not well unders
Electronics Forum | Wed Apr 24 13:23:37 EDT 2002 | gsmguru
Our design group is looking at using a IMPCB material for a power amplifier design. They would like to to use this because of it's excellent thermal properties. This would be used to create a "SIP" module that would plug into a std FR4 pcb with the c
Electronics Forum | Sat Aug 15 09:34:06 EDT 2009 | davef
It would be nice, save you money, improve yield, improve reliability, etc. if your reflow process was more effective. It sounds like you're not getting the part hot enough during reflow soldering. Tell us about: * Measured temperature on this bluetoo
Electronics Forum | Wed Jul 05 10:54:26 EDT 2006 | slaine
In the last couple of weeks ive been working with a new mechanical design engineer, i knew things were going to be difficult when i caught him putting a trial through a reflow oven using loctight thread lock to hold a smd led in place. but today i ha
Electronics Forum | Tue Feb 01 10:11:36 EST 2011 | clampron
good Morning, it looks from the peak temperature that this is a RoHS application? If so, is the BGA that you are having issues with leaded? If so, you might be experiencing "ball drop" where the ball becomes disconnected from the component substrate
Electronics Forum | Mon Jul 07 11:45:45 EDT 2003 | lromero
Do you know what the maximum temperature rating is for the devices. But in my past experience you could be seeing the following. Excess thermal ramp rates typically you would like to see 2 to 3C/sec in the reflow oven, if it is greater than this i wo
Electronics Forum | Mon Dec 20 07:09:03 EST 1999 | Christopher Lampron
Ron, The simplest way to process fexible PCB's that I have found is to use a process carrier fixture. There are companies that manufacture process carriers that are capable of holding flex through stencil, placement and reflow. The carriers are capab
