Electronics Forum | Tue May 31 20:20:54 EDT 2005 | Rob
Hi, I was informed that our supplier of PWB's will start using RoHS compliant Materials but will still support HASL. And these are the materials that they will use: Standard FR-406-408 High Temp - polyimide, cyanate ester High Temp - Roger's, Teflo
Electronics Forum | Tue Apr 18 10:08:51 EDT 2006 | russ
We use materials such as G10, durapol, or FR4. We put a lot of holes in the fixtures so that only enough material is left to support the board during reflow to prevent sag/ warp or whatever. We also try and keep all bot side material in unpopulated
Electronics Forum | Wed Oct 22 14:55:00 EDT 2014 | rrosera
Does anyone have any experience with labels capable for withstanding both re-flow and machine wash cycle? We've tried a few different materials and the ones that make it threw re-flow wash off and the ones that make it threw was tend to melt in re-fl
Electronics Forum | Thu Feb 19 12:37:46 EST 2004 | MRMAINT
LOOKING FOR THE PROS AND CONS OF BOTH WATER SOLUBLE AND NO CLEAN PROCESS MATERIALS AS IT APPLIES TO BGA REFLOW.IS IT POSSIBLE TO REMOVE ALL W/S FLUX AFTER INLINE WASHING. THANKS MRMAINT
Electronics Forum | Mon Oct 02 12:22:46 EDT 2023 | carl_p
Hi, I use this Material, you can get a few different types to work with certain sensors but I've used them for a solid 12 months now for reflowing. I'm using multiple board materials down to 0.4mm & I've had zero issues. https://www.datumalloys.com
Electronics Forum | Thu May 31 13:20:30 EDT 2007 | HOSS
Looking to qualify a new lead free WS paste. I'd like to know who is happy with what material and why. Reflow consistency and cleanability are critical for us. I have a paste I'm using now that is giving us mixed results (reflow issues). Any info
Electronics Forum | Fri Jan 16 16:36:37 EST 2009 | rwyman
We've used our standard chipbonder- Heraeus PD944- for this type of application. While it does cure before reflow, when the part is placed onto the site, the material compresses and spreads and thus that potential standoff isn't an issue. We've als
Electronics Forum | Wed Sep 30 11:42:45 EDT 1998 | Ray N. Lopez Mata
I am looking for a material which may be used to deflect heat / shield a component from heat. The component would be exposed to the heat during the card reflow process. I would need the material to be of such a nature that I could form a cover by
Electronics Forum | Mon Jun 18 10:34:40 EDT 2007 | swag
If you are using a fixture/carrier in the oven, make sure that it is not too restrictive on the perimeter of the board/panel. A carrier intended to limit warpage can actually cause warpage if the expanding PCB material has no place to go during refl
Electronics Forum | Wed Jul 14 09:33:18 EDT 1999 | Dave F
| Our plant in Slowakia tries to convince me that it is not possible to reflow FR2 PCB-material. | At this moment the PCB's leave the reflow dark coloured and they are schrinked. | | I'm still waiting for a reflow profile, because I can't believe th
