Electronics Forum | Wed Oct 05 15:31:44 EDT 2005 | chunks
Thanks Amol, You brought up some good ideas that we'll use. Has anyone ever heard of under filling the BGA (after reflow) with a material that cures, then thermal removing the BGA to check the acual size of the ball to pad?
Electronics Forum | Fri Sep 04 04:39:08 EDT 2015 | grahamcooper22
Maybe look at reducing the time above liquidus to @ 60 seconds. HF materials tend to want tighter reflow profiles...halogen activators are great at higher temps and longer reflow profiles..but HF prefer shorter profiles. The HF pictures look like the
Electronics Forum | Sat May 27 14:13:35 EDT 2000 | Madan Mohan
Hi Has anyone tried rework of lead-free assemblies? Any issues? Is there a solution for achieving high temperatures without adversely affecting board and component, considering the fact that higher temperatures are needed in rework machine compare
Electronics Forum | Thu Jul 20 12:21:05 EDT 2000 | Dave F
Bob: Some people suggest different lead-free solder formulations for wave, reflow, and hand soldering. * What are your thoughts on this? * What are the factors that contribute to using different lead-free solder formulations for wave, reflow, and
Electronics Forum | Thu Nov 01 17:42:45 EST 2001 | davef
Wolfgang is correct. Search the fine SMTnet Archives to find information on the component weight versus pad size during adhesiveless double sided reflow. Do not mess with different solder materials.
Electronics Forum | Wed Sep 30 12:32:15 EDT 1998 | CHAD HAIMA
I am looking for a material which may be used to deflect heat / shield a component from heat. The component would be exposed to the heat during the card reflow process. | | I would need the material to be of such a nature that I could form a cov
Electronics Forum | Mon Oct 30 10:40:30 EST 2006 | SWAG
We are performing a pre-bake + reflow experiment on this same material today per mfg's recommendations. I'll let you know what happens.
Electronics Forum | Fri Aug 03 19:03:32 EDT 2001 | seand
Hello John, What is the key reason requiring that this unknown material be injected from below vs. dispensed prior to placement. Is it an issue with reflow temperatures, effect on placement/thermal expansion? Is this a true requirement or specul
Electronics Forum | Fri Aug 02 10:06:37 EDT 2019 | davef
I don't get it. The liquidus of 80Pb/20Sn is like 280*C. Your reflow temperature got nowhere near that value. Where did that material go? Is it folded back under the component? Disappeared? Was it ever there? Ask someone while analysis tools to hel
Electronics Forum | Tue Oct 16 17:38:42 EDT 2001 | lileubie
Depending on the type of teflon material, thickness, and reflow profile requirements, these will have a direct bearing on your maximum process allowable PCB pallet size. You'll want to be careful on how big the PCB or pallet is. Larger teflon PCBs
