Electronics Forum: materials studio molecular (Page 1 of 1)

Aqueous cleaner water disposal

Electronics Forum | Mon Sep 09 19:17:56 EDT 2002 | dragonslayr

steve- once again I mention that the lead that is actually in the water is in solution i.e. the lead is in a molecular form that has attached to a H2O molecule. To have a minimum of lead that is below the regulated ppm, there cannot be any chunks,

Re: Reflow soldering a Flexi-Rigid pcb

Electronics Forum | Sun Apr 05 09:46:47 EDT 1998 | Earl Moon

| We are looking at reflow soldering some Flexi-rigid | pcbs. I have heard that IR reflow soldering can make the Polyimide "self heat" and cause de-lamination. | Does anyone have any info. The thermal problems associated with polyimide rigid/flex de

Re: T sub g

Electronics Forum | Thu Jun 25 14:41:07 EDT 1998 | Earl Moon

| Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection Handb

Re: Solder Resist Solder balls

Electronics Forum | Tue Dec 22 12:32:16 EST 1998 | Earl Moon

| Folk's, | I'm in need of some help / direction. I'm working on my thesis for a masters based on looking at the effect's of the solder resist promoting / reducing the amount of solder ball's during wave. I'm looking at thing's like colour, texture,

Re: T sub g

Electronics Forum | Fri Jun 26 11:27:12 EDT 1998 | Earl Moon

| | Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection Han

Re: T sub g

Electronics Forum | Fri Jun 26 15:37:50 EDT 1998 | Justin Medernach

| | | Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection H

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