Electronics Forum | Thu Mar 31 17:27:36 EST 2005 | russ
Are we possibly talking palladium instead of platinum? I haven't yet heard of platinum terminations (seems expensive) If it is palladium over nickel, I can tell you that you need to reach 225-230 Deg. C in reflow and the TAL should be about 90 sec.
Electronics Forum | Wed Aug 05 07:46:46 EDT 1998 | Earl Moon
| We have mixed to negative feelings about Omikron, but I beileve it is due to problems with the board fabricator rather than the process itself. When done properly, our Omikron boards have had very good solderability. However, we have had several
Electronics Forum | Wed Sep 10 02:47:49 EDT 2003 | Dennis O'Donnelll
This is a problem of contamination in the plating bath. Most prominent with white tin and some gold over nickel plating processes. Rather than argue with your vendor over the issue, and to avoid future recurring problems, I use either HASL or elect
Electronics Forum | Fri Mar 05 05:36:23 EST 2010 | grahamcooper22
Are both photocouplers exactly the same ? More importantly, do they have exactly the same metalisation on their legs ? I have experience where same relay devices have different leg metalisations (one was matte tin / one was gold over platinum over n
Electronics Forum | Tue Aug 17 13:24:47 EDT 2004 | blnorman
We have parts that have electroplated tin over nickel. The mfg. assures us the minimum thickness of the tin is 5 microns. Cross sections have shown many instances of 1 micron and pits that go down to the nickel barrier layer. A request for thicker
Electronics Forum | Tue May 12 22:57:30 EDT 2009 | davef
Polyimide bare board with tin over nickel solderability protection.
Electronics Forum | Fri Nov 07 15:57:56 EST 2003 | Marc Simmel
Are there specifications or recommendations for electro-deposited tin-lead plating thickness on austenitic stainless steel that would provide a shelf life of 1 year? 6 months? Would 2 to 3 microns (78 to 118 micro-inches) 90/10 tin-lead over 1.27 mi
Electronics Forum | Wed Sep 01 08:27:38 EDT 2004 | davef
Zinc from the brass [Cu3Zn2] diffuses into the tin causing solderability problems. Just 0.001% of Zn in your solder can render it fit for the scrap heap. So, you need a barrier plate between the brass and the tin. Copper or nickel-plating is commonl
Electronics Forum | Fri Nov 16 03:38:03 EST 2018 | premkumar_haribabu
Hi all, We have to solder a nickel tabs ( coming in SMT reels ) in to HASL PCB finish pads using refow oven & during this we facing poor wetting issues, more voids & we done pull strenth , its came out with in 1 kg ,I doubt that nickel coated materi
Electronics Forum | Thu Feb 19 12:35:13 EST 1998 | Earl Moon
| | We are currently investigating alternatives to HASL for circuit boards with 20 mil pitch smt pads and below. If you have experience with this product or simular immersion tin products with respect to manufacturing or assembly I am very interest
