Electronics Forum: max time above 217 (Page 1 of 7)

5 zone ovens

Electronics Forum | Fri May 26 10:17:21 EDT 2006 | pjc

Here are settings for a Vitronics SMR500 oven for Indium Corp. 5.1 No-Clean Pb Free solderpaste, the product profiled was of medium thermal mass: RTS, Temp C 120, 170, 195, 248, 264, conveyor speed was 43cm/min (17"/min.) Peak temps were reached in

BGA 1517 XLINX REFLOW PROFILE

Electronics Forum | Thu Jun 02 11:01:28 EDT 2005 | davef

Xilinx recommended reflow ||Sn-Pb Eutetic||Sn-Pb Eutetic ||Pb-Free||Pb-Free Profile Feature||Large Body||Small Body||Large Body||Small Body Average ramp-up rate (TL-TP), *C/seconds max||3||3||3||3 Preheat - Temperature Min (Tsmin), *C||100||100||150|

SMT voiding

Electronics Forum | Thu Oct 25 13:39:29 EDT 2012 | cyber_wolf

Wait a minute...Your peak temps are PbFree like. Why is your profiler looking at time above 183 ? What is the time above 217 ? I thought we were looking at time above 217 not 183.

PLCC LEADS not solder in SAC305 paste

Electronics Forum | Thu Jun 28 09:54:06 EDT 2012 | mosborne1

Dave, They rework fine. All solder joints on the whole board look great especially for lead free sac305. Here are the reflow specs: SAC305 no clean solder paste – Kester EM907 Kic thermal profiling device – 50%process window green light profile. • M

New Oven Now Getting PCB Twist

Electronics Forum | Tue Feb 24 15:31:44 EST 2009 | pcbrookie

Wrongway - Interesting about the rails. I'll check to make sure operators are leaving a little 'wriggle room' on the rails in case they are in fact getting narrower in the middle. SWAG - I suspected the initial temp. might be a bit hot, thus causin

Lead free BGA's & std SnPb paste

Electronics Forum | Fri Oct 31 13:06:42 EST 2003 | Kris

Hi, What would also be important is the time above 217. 20 secs above 225 may be the same as 45 secs above 218 That 7 degres might just buy you enough to sweep the non lead free components through Has anyone tried 220 or 218 peak temp but at lo

Lead-free BGA in Tin/Lead Process

Electronics Forum | Wed Oct 06 17:50:00 EDT 2010 | jamyboy

IBM Intel motorola did exhaustive studies on this and found that the best thing to do is (as others pointed out) the PBfree BGA reaches 217 minimum and the time above 217 must be extended to allow mixing of the 2 alloys. See attached a little diddy

Alum Electrolytic Caps

Electronics Forum | Mon Oct 10 20:06:59 EDT 2005 | nuezmaster

Does anyone have any experience running Aluminum Electrolytic Caps with a SAC305 alloy. The profile for the solder calls out a peak temp of 235-255C and 60-75 seconds above 217C. Most can cap manufacturers are calling out for 230-245c max for no lo

SAC solder balls reflow with Sn/Pb paste - Voids Issue

Electronics Forum | Thu Oct 05 16:06:33 EDT 2006 | cw

Thanks! What's your ramp rate?2 - 3C/sec? What's your time above 217C. What's your peak temp?

Solder Joint Discolouration

Electronics Forum | Fri Jan 04 08:02:03 EST 2019 | ameenullakhan

Hi, Thanks for the valuable feedback. We are at lower spec : ( TAL )Reflow time : Around 50 Sec ( Above 217 deg C) Peak Temp : 240- 245 deg C. Any other suspects. And your English is fine :) Regards, Ameen

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