Electronics Forum | Sun Apr 22 23:46:28 EDT 2001 | z1040223
Hello all My company is getting ready to implement solder bump flip chips in the production line in the future. We are a contract manufacturer. We currently have the SMT facilities to do up to 1.5mm pitch BGA's, 0402 and other standard SMT. What equ
Electronics Forum | Sat Nov 17 12:58:12 EST 2007 | mika
I agree with previous postings regarding print speed: Solder paste type/versus fine pitch. Question: Is this a double sided pcb with fairly easy component packages on both sides? In such case, consider make the panel like this: Every second pcb in
Electronics Forum | Mon May 28 07:30:52 EDT 2001 | bobwillis
Here is a draft visual inspection guide for underfill, please pass this on to the relevant people for any comments or suggestions. I am currently working on the pictures to go with the reference guide. Flip Chip/uBGA Underfill Visual Standards The
Electronics Forum | Tue Jun 05 03:56:52 EDT 2001 | JohnW
Flip Chip/uBGA Underfill Visual Standards The aim of this document is to produce some draft text and then select photographs to make up a draft visual standard for inspection. There is also a need to produce some reference material for C Scan image
Electronics Forum | Sat Mar 06 20:46:21 EST 1999 | Dean
| | | | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | | | Concerning the BGA stuff, I'm getting about 60
Electronics Forum | Sun Mar 07 08:19:24 EST 1999 | Earl Moon
| | | | | | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | | | | | Concerning the BGA stuff, I'm getting
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