Electronics Forum | Wed Oct 24 02:09:34 EDT 2018 | simondsr
Hi everyone, I am new to this SMT. I have just graduated my study, have zero experience in SMT industry as I studied Automotive before. Ok lets proceed to the main objetive, I have a question regarding package rebake. From what I have learned, the
Electronics Forum | Fri Nov 02 19:34:19 EDT 2018 | sarason
I am assuming that your application is Automotive. The logic here is that the product has got to at least run for 8 years or more. The prebake removes any moisture that may creep into the product during the wait time. A little moisture combined with
Electronics Forum | Wed Jan 09 01:22:39 EST 2019 | kenneth0
Hi Simond, The baking process is likely to remove any moisture after the cleaning process. We wouldn't want any moisture trapped as this might cause delamination if the package is subject to subsequent heating/reflow process. Hence there's a staging
Electronics Forum | Thu Mar 15 12:33:50 EDT 2007 | ck_the_flip
To do a profile at most companies, if you don't have a scrap board handy, you'll use the already-soldered board that's already been through ONE reflow cycle. You spend time attaching T/C's with the aluminum tape - after all, the prep-work is half th
Electronics Forum | Wed Aug 25 19:35:48 EDT 2004 | russ
This is highly dependent upon your board, vision inspection, part rotation, part type, layout, number of P/Ns per (1 pers or 100 pers) feeder layout, optimization, nozzle changes, etc... all have significant impact on placement speed. I find if you
Electronics Forum | Thu Aug 26 13:20:56 EDT 2004 | pjc
Machine design plays a major factor in actual placement rate vs. the published tact time max speed. For example, random access horizontal turret head machines can vary greatly depending on nr. of different components and size ranges, while the dual g
Electronics Forum | Mon Dec 13 06:21:14 EST 2004 | Peppe
I work in electronic industry and I'm interested about the standard values of FIT (failure in time or useful lifetime) of soldering. In essenze my question is : how much time can work a good solder joint, before became fail ? Exist a minimum and ma
Electronics Forum | Tue Sep 12 01:50:22 EDT 2006 | meritajs
Hi All, We find out that some companents in leed free reflow soldering process have bad wetting and soldering This soldering problems caused by companent storage time after shipment Could somebody inform us about maximum storage time for different c
Electronics Forum | Tue Sep 12 19:36:17 EDT 2006 | davef
We've been soldering leadfree components for maybe 15 years. We'd be surprised not to be able to store components for at least a year, not that we purposely do that. Component fabricator process determine the maximum storage time for components. M
Electronics Forum | Thu Apr 25 09:27:03 EDT 2002 | fmonette
Michael, This concern is well covered in J-STD-033, section 8.6 Board Rework. "...If the component temperature exceeds 200C, the board may require a bakeout prior to rework..." In other words, you only need to worry about moisture related defects w
