Electronics Forum | Mon May 15 20:10:27 EDT 2000 | Dave F
David: How about starting with MCMs? IPC docs are: * 2225 - Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies * DD-135 - Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip
Electronics Forum | Fri Apr 17 21:46:18 EDT 1998 | Matthias Mansfeld
I plan to design a multichip module which contains 1 chip with about 200 pads and 2 chips with about 50 pads, no other components.The whole module shall replace as intermediate solution a single chip CPU in QFP208. Thus, the MCM itself must have t
Electronics Forum | Thu Aug 25 10:32:03 EDT 2005 | davef
IPC-2221A, Generic Standard on Printed Board Design, the base document that covers all generic requirements for printed board design, regardless of materials. From there, the designer can choose the appropriate sectional standard for a specific techn
Electronics Forum | Fri Jan 18 18:19:38 EST 2008 | arun2382
Is normal DI rinse cycle enough to wash away all residue after SMT assembly of high density substrate? This substrate would later be over molded to form MCM module package and I am seeing delamination in high density areas of the substrate at MSL3
Electronics Forum | Wed Jan 27 22:39:46 EST 2010 | wmeliane
Thanks for the recommendations. We have settled on the new Juki CX-1. Juki states that the machine is a hybrid between a MCM placer and an SMT placer. This machine, if it is capable to do what Juki says it can do, is exactly the machine we need. Ma
Electronics Forum | Thu Sep 05 01:56:38 EDT 2013 | ciciswift
the Layers - > Add the Layers, or click the shortcut icon on the left toolbar, enter in the wake of a "Number of new the Layers" need to increase the Number of Layers. 2. Delete the layer: Edit - > the Layers - > Remove the Layers, and choose to dele
Electronics Forum | Sat Dec 16 10:03:32 EST 2000 | Dave F
Castellation. A recessed metalized feature on the edge of a leadless chip carrier [LCC] that is used to interconnect conducting surface or planes within or on the chip carrier. If you search the fine SMTnet Archives, you find: * A fine thread [cast
Electronics Forum | Tue Aug 01 16:42:45 EDT 2000 | Robert Hartmann
Our company is putting a BGA/CSP package assembly line together. We have been studying different assembly houses reliability (short and long term) monitoring programs. I was wondering if some of you who use BGA's/CSP's for your MCM's and Hybrid's
Electronics Forum | Wed Aug 03 05:16:11 EDT 2005 | kokjianling
hi all, i want to find out the differences of the manufacturing processes between - PBGA - EBGA - CTBGA - Themally Enhanced PBGA(TEPBGA) - High Performance BGA - MCM-PBGA - Chip array - chip array (CASON) - Super FlipChip - flip Chip CSP (FCCSP) - St
Electronics Forum | Tue Jan 30 21:15:51 EST 2001 | davef
You seem to pretty far from shore to begin thinking about boats and floatation devices. Most laser trimmers are used by: * Semiconductor fabricators * Resistive component fabricators * Hybrid circuit assemblers Component fabricators and hybrid [
