Electronics Forum | Tue May 12 07:26:16 EDT 2009 | emmanueldavid
Jorge, The basic thumb rule to measure Adhesive Strength remains as bonded Chips at Post Reflow should not move around or misplace when Your Thumb Finger try to do so which called as Thumb Force Test. However as Dave stated, there are various Stre
Electronics Forum | Mon May 11 12:15:46 EDT 2009 | jorge_quijano
Hi, I just want to know how to measure the strength of a 0603 after it's cured, we are using Heraeus PD944 with a 30-7 mils stencil, glue depositions looks well, but I don't know how to measure it? Thanks
Electronics Forum | Mon May 11 16:23:08 EDT 2009 | jorge_quijano
Yes, this is for a double sided board, (bottom) the issue is that the board has a lot af hand ion components before wave soldering, and some components are falling off within this process, even if I hit the 0603s with my finger It falls.
Electronics Forum | Mon May 11 22:47:45 EDT 2009 | davef
We'd expect that a 0603 in properly cured, in-date code, properly dispensed chip bonder would take 5-8 pounds to push off the board.
Electronics Forum | Fri May 15 09:41:58 EDT 2009 | cyber_wolf
Use loctite chipbonder and forget about all this pull testing. I know that Loctite works good because it pulls a chunk of solder mask off the board when you push a part off.
Electronics Forum | Mon May 11 12:50:55 EDT 2009 | stepheniii
What is the purpose of glueing it? If it is glue the bottom side parts followed by reflowing the top side parts followed by wave soldering the bottom side parts, then it's easy to measure. Hold the board with the 0603s facing down. If they don't f
Electronics Forum | Fri May 15 08:04:32 EDT 2009 | rwyman
higher temp/shorter time). Solder mask may be a factor as well. I've seen parts get knocked off where the glue is still affixed to the part, along with a nice piece of solder mask from the board. If you can knock a part off with casual contact, th
Electronics Forum | Wed May 20 09:52:50 EDT 2009 | dwelch123
Use a push/pull tester. I use an OBA inst. works Ltd. tester. Just because mask comes off with bonder doesn't mean bonder is strong or cured right. Mask can be weak in between pads do to area size. Do it right and you'll know for sure. To many people
Electronics Forum | Fri Mar 30 13:06:50 EST 2001 | aortiz
Hi, I need support on the method or applicable standard to measure the shear force strength on chip capacitors and resistors. I know the soldered joints strength is related to land desing, solder volume, pcb and component solderability, component
Electronics Forum | Fri Mar 30 18:24:12 EST 2001 | davef
There is no test. Beyond the issues that you mentioned that affect shear, an article published in a recent [1/01] "Journal Of Surface Mount Technology" documents that shear is also dependent on the rate of shear. You may be able to contact the auth
