Electronics Forum | Thu Feb 23 09:59:09 EST 2006 | SIR
We have an AUREL CS1222 machine to measure the thickness of the solder paste deposited on a bare board by a stencil printer. This device has a laser beam that has to be put on the pad where you want to measure the solder paste thickness. The measure
Electronics Forum | Fri Sep 25 16:47:57 EDT 2009 | esoderberg
0.5mm pitch QFP's are typically mixed with large components on all of my boards. I usually use a 6 mil stencil with a minimum aperture width of 10 mils. Normal aperture size is 10 x 50 which causes shorts about 20% of the time. A recent purchase of
Electronics Forum | Sat Sep 04 11:58:44 EDT 2004 | Dhanashekar
Can anyone suggest me if it is necessary to measure the paste thickness after contact Screen printing.Is it a very vital parameter for the production process?
Electronics Forum | Thu Feb 23 13:56:21 EST 2006 | slthomas
I have dealt with it before and usually it's consistent, so you use some simple math to work around the issues. Now, if you have so much variability between different locations on your board for resist thickness, HASL thickness, etc., that it fouls
Electronics Forum | Tue Sep 07 06:32:32 EDT 2004 | C Lampron
Dhanashekar, Yes this is an important proces control tool. This will show if you printer setup is correct however, I put more importance on coverage. If your paste height is 1 mil shorter than it should be, you may need to look at your printer setup
Electronics Forum | Wed Jul 06 09:07:28 EDT 2016 | davef
Hi Pavel IPC-6012 - Qualification and Performance Specification for Rigid Printed Boards, Paragraph: Solder Resist (Solder Mask) Requirements, Sub-paragraph: Solder Resist Thickness has words to the effect … * Solder mask thickness shall be accordi
Electronics Forum | Tue Jun 07 10:38:34 EDT 2011 | davef
Boots: Here's several methods for guessing at the amount of solder on your connection: * First, 'Down & Dirty' ** Assume that the solder is flat, which is reasonable since it's 'flattened' by the component package ** Assume 100% paste transfer from t
Electronics Forum | Sat Jan 04 09:02:17 EST 2003 | davef
Q1. What is the recommended stencil thickness to apply the proper amount of solder for 0603 components? A1. The proper amount of solder is determined by: * Metal content of the solder paste. * Stencil thickness. * Aperture opening. * Other factors,
Electronics Forum | Fri Jul 11 08:17:22 EDT 2008 | aj
Hi Dave, Yes that is correct. I had a XRF carried out on some boards that I am having solderability issues on and the report came back with 0.04um - 0.05um as the measured gold thickness. Previous batches that went through fine measured 0.07-0.11u
Electronics Forum | Wed Jan 25 16:18:12 EST 2012 | wrongway
Your uising 6 mil thick screen on 0603 and sot-23 and you think you need more paste? when i use a 6 mil screen on a sot-23 and 0603 it is almost to much paste. 5 mill does just fine on those parts but if you think you need more paste then don't go t