Electronics Forum | Thu Apr 09 14:02:29 EDT 1998 | Earl Moon
| | I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whe
Electronics Forum | Thu Sep 02 16:52:31 EDT 1999 | Earl Moon
| | | Has anyone done or seen any studies done documenting what may be the affect of hardware such as screws in the parimeter vicinity of BGAs on a circuit board? | | | | | | What I'm really after is anything describing how close a screw/washer/nut
Electronics Forum | Thu Sep 02 15:50:30 EDT 1999 | R Scheller
Has anyone done or seen any studies done documenting what may be the affect of hardware such as screws in the parimeter vicinity of BGAs on a circuit board? What I'm really after is anything describing how close a screw/washer/nut combination which
Electronics Forum | Thu Sep 02 16:37:23 EDT 1999 | R Scheller
| | Has anyone done or seen any studies done documenting what may be the affect of hardware such as screws in the parimeter vicinity of BGAs on a circuit board? | | | | What I'm really after is anything describing how close a screw/washer/nut combin
Electronics Forum | Thu Sep 02 16:06:33 EDT 1999 | Earl Moon
| Has anyone done or seen any studies done documenting what may be the affect of hardware such as screws in the parimeter vicinity of BGAs on a circuit board? | | What I'm really after is anything describing how close a screw/washer/nut combination
Electronics Forum | Fri May 31 12:28:45 EDT 2019 | slthomas
You really need to define what you mean when you say "bend" and when you say "break". You might have zero damage to a bare board but cracked solder joints and ceramic caps on an assembly, given the same amount of bending or stress. It all depends on
Electronics Forum | Wed Jun 02 12:14:09 EDT 2010 | smt_guy
what is the scenario? The more the solder joint the more capacitors are prone to mechanical stress or the lesser the more mechanical stress? what about uneven solder joint fillet? one side is 25% then other side is 75% or 100%? please put in your
Electronics Forum | Fri Dec 30 11:54:53 EST 2005 | John S.
Seen cap cracking before. It can be caused by thermal stress as noted above, but don't discount mechanical stress and handling. Your depanelization method is a strong candidate. We applied strain gages to baords and benchmarked various mechanical
Electronics Forum | Fri Mar 20 07:42:44 EDT 2015 | eezday
Dendrite growth is not typically associated with a flux reation but rather is a result of mechanical stress. The stress can be from any source including stress induced by other components, environment, plating or even bimetallics. Dendrites are most
Electronics Forum | Wed Jun 15 17:47:48 EDT 2011 | davef
Classic mechanical stress crack pattern. Pretty Try baking your boards for 2 hours at 100*C Minimum spacing between board features and v-score or break away is 30thou.
