Electronics Forum | Wed Jan 30 08:30:33 EST 2002 | seto
Hello Dave, Mechanically the conection between the component pad and PCB pad is good (the solder joint is very strong). The problem is associated with poor contact after the use by the customer (vibration, temperature, etc). You can see the pictures
Electronics Forum | Wed Aug 28 18:08:07 EDT 2002 | MikeF
This looks like it may be a good application for an Air-Vac or Wenesco type solder station. It is a solder pot that has a small motor to pump solder up through a chimney. You can put different nozzles on the top of the chimney, so you only apply sold
Electronics Forum | Wed Mar 30 16:46:03 EST 2005 | chunks
There is no spec because solder is designed to provide an electrical connection not a mechanical connection to hold the part on. If it where mechanical we�d be welding our parts on. Your pad width and length are derived from your component manufact
Electronics Forum | Wed Jan 07 17:34:52 EST 2015 | duchoang
Customer puts our board to thermal test. Test cycle is -55c to 85c, repeat cycle in 15-20min. After 600 cycles, lot of TSOP joints are cracked, leads lifted. There are reasons such as thin PCB, mechanical impacts, warped PCB... My question is, how lo
Electronics Forum | Thu Dec 09 15:19:21 EST 2004 | nrocco
Can anyone point me in the direction to find some IPC standards for lead free solder joint reliablity tests, such as shear tests, pull tests, vibe tests, enviroment tests, etc. I need to know what the specs. are on all aspects of reliability and how
Electronics Forum | Thu Dec 09 17:45:27 EST 2004 | davef
You're correct. There is no criteria for no-lead, but there none for SnPb, either. Solder joint strength in pull/shear will vary with lead geometry, solder volume, lead metal/metallization, the way the test is done.
Electronics Forum | Mon Jun 24 23:21:27 EDT 2019 | sssamw
You may need tell us the background, how PCBA being tested, the test setting and spec. Solder crack maybe due to CTE mismatch or mechanical strain.
Electronics Forum | Mon Jun 03 13:01:59 EDT 2019 | slthomas
Is there any chance that the boards were mechanically stressed (for instance, installed in a fixture) before, during, or after the testing? I'm just looking for other possible root causes.
Electronics Forum | Tue Jan 05 10:17:25 EST 1999 | Earl Moon
| | | Does anyone have any experience with vibration testing of BGA packages and assemblies? We are starting to design BGA's into some of our products and we have not found very much information on vibrational test results. Any information will be
Electronics Forum | Thu Jun 25 18:28:23 EDT 1998 | Earl Moon
| Looking for articles/data comparing the quality/reliability of mass | reflowed SMT solderjoints versus hand soldered SMT solderjoints. As solder joint quality most often is subjective - that is visually compared with graphic examples, IPC is the B
