Electronics Forum | Wed Jan 29 17:19:50 EST 2003 | albertoh
Hello!! I need to know the land pattern specs for a melf resistor with dimensions length 0.415(+/-0.02) and width 0.144 (+/-0.008) inches. Because i have tombstone problem. My stencil design is 10 mils thickness in order to avoid the issue but it hel
Electronics Forum | Thu Jun 26 07:44:07 EDT 2008 | kmeline
Hello, we are having issues with two assemblies where the Melfs will lift or not solder on one end of the components. Has anyone had issues with this in the past? What can be done to help this? Thanks
Electronics Forum | Thu Jun 26 08:20:42 EDT 2008 | cyber_wolf
Check your pad spacing on the board. Look at the IPC specs for pad design.
Electronics Forum | Thu Jun 26 09:33:11 EDT 2008 | realchunks
Yes, try slowing it down. It will indicate if your ramp up is too fast.
Electronics Forum | Thu Jun 26 09:47:12 EDT 2008 | kevinjm
Hi Mark, Are these lead free parts on a leaded process? If so, that could be your problem. We had the same issue in my place a while back.
Electronics Forum | Thu Jun 26 07:53:39 EDT 2008 | realchunks
Depends on a few variables. Could be the part, your profile, your paste, your stencils..... many things affect it.
Electronics Forum | Thu Jun 26 09:09:27 EDT 2008 | kmeline
The pad size is okay. I have also requested the manufacturer's recommend reflow profile. I have seen some issues with 0402 caps that we run also but for the most part solder paste does okay. I think the cap issues is stencil related. Still trying to
Electronics Forum | Thu Jun 26 09:42:16 EDT 2008 | gabriella
Hello Mark, I would recommend to look again on the pads. in many cases board design is causing these issues. Check 1. Is pad size good for the part 2. Are both pads the same size 3. traces connected to the pads should be same size 4. vias connecte
Electronics Forum | Mon May 06 11:49:20 EDT 2002 | Jacob
Hello all, I am having soldering issues with an Everlight component it is a TM4201/TR2 (Right angle IRDA with a 1mm pitch). The problem I have is that after reflow the solder joints look perfect, but during test we are losing 7 micro amps as soon as
Electronics Forum | Mon May 06 16:14:41 EDT 2002 | russ
Would the lead finish on this part happen to be Paladium? I had a problem similar to this some time ago and we found the lead finish was not tin/lead over copper but paladium over nickel. We had to increase the reflow to 225 deg. C peak temp with t
