Electronics Forum | Wed May 20 15:10:35 EDT 1998 | Dave F
We notice that DI water seems to tarnish or discolor the metal packaging on crystals and DIN connectors. Our marketing types like the shiney metal surfaces. We don't want to hand solder these parts after washing. Any suggestions? Dave F
Electronics Forum | Wed May 20 20:16:29 EDT 1998 | D. Lange
| We notice that DI water seems to tarnish or discolor the metal packaging on crystals and DIN connectors. Our marketing types like the shiney metal surfaces. We don't want to hand solder these parts after washing. | Any suggestions? | Dave F Dave,
Electronics Forum | Wed Jul 05 20:54:17 EDT 2000 | Dave F
Hi Patrick: Mike is correct. Taking it a little differently ... The approach you take is dependent on: 1 Type of gold finish 2 Source of the staining. Since you�re talking gold fingers, this is probably hard gold. So, � * If it�s a water or an o
Electronics Forum | Wed Nov 02 17:49:07 EST 2005 | grantp
Hi, We used a batch oven from Reddish Electronics out of the UK. It was convection, and ok, but had limitations. Batch convection ovens start to heat up, so the metal of the oven is hotter and hotter and it effects the profile. So we ended up need
Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef
90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125
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