Electronics Forum | Wed Feb 23 03:12:25 EST 2011 | pkannan
You are very right. There are 2 major factors 1) There is going to be Flux separation. This is basically due to fact that metal particles are heavier than the Flux vehicle system, and due to gravity effect they slowly drift downwards leaving the ligh
Electronics Forum | Wed Feb 23 03:22:47 EST 2011 | pkannan
(Corrected the Subject line - sorry for Spelling ) You are very right. There are 2 major factors 1) There is going to be Flux separation. This is basically due to fact that metal particles are heavier than the Flux vehicle system, and due to gravity
Electronics Forum | Tue Aug 27 08:12:35 EDT 2002 | jmaruska
Do you have some experience with solder paste WS1208. What is the "best" conditions for printing process? I mean type of stencil, apertures, squeegee. Do you have original data sheet of this solder paste? - life time, working time on the stencil, sh
Electronics Forum | Tue Feb 09 10:16:15 EST 1999 | Jim Gleason
Earl, We have found that many people get closer to a zero defect program using pallets. Since you eliminate manula masking you eliminate on huge area of possible defects production. Since the pallets can align connectors etc, you get less defects due
Electronics Forum | Thu Jun 05 03:45:58 EDT 2014 | angelyeoman
In modern times. there are various kinds of secure devices to provide safe environment for people. For example the security camera can be used to monitor suspicious person come and go in the office or people's own home. Besides the vehicle inspection
Electronics Forum | Wed Jun 26 10:36:24 EDT 2002 | Steve L
Thanks for all of your valuable inputs. The paste we are useing is PWS0111Ae36 (Alpha MEtal), peak temp from 210 to 225 C. The paste was on the floor about 3 weeks. ianchan, when you mentioned "no more than 6 hrs in the stencil", you mean no more t
Electronics Forum | Tue Feb 19 12:41:20 EST 2008 | patrickbruneel
Yes dendrites can cause electrical shorts. The first stage of dendritic growth is a dark fern like pattern which reduce surface insulation between anode and cathode. In a more advanced stage the ferns transfer the plating metals of the conductors and
Electronics Forum | Fri Sep 25 12:26:34 EDT 2009 | clampron
Some information on the web regarding RoHS and tip life... What problems are there for using Lead-free solder? ? Higher melting point of Lead-free solder may cause physical and thermal damage to components and PCB. ? Lead-free solder has poor
Electronics Forum | Mon May 15 12:36:12 EDT 2017 | edhare
I don't believe there should be any issues with > the HASL finish. The issue is how long on the > shelf and is a bake out required to remove > moisture from PCB, as in any FR4 PCB's that may > have had time to absorb moisture. > I don't believe
Electronics Forum | Mon Nov 27 17:47:23 EST 2000 | Dave F
Gyver: Lemme take a wack [if you�ll excuse the expression, given direction of the later discussion] at your questions. Q1. Will the baking of BGA or PCB cause more oxidation before the SMT process? A1. It certainly will not cause less oxidation,
