Electronics Forum: micro and parts and hling (Page 1 of 1)

BGA rework and inspection

Electronics Forum | Thu May 30 10:31:03 EDT 2002 | robbied

Hi Yannick. This is an issue that we are just recently getting into but here is some ifo that I have gathered so far. I have seen/ used 2 different rework machines. The one we have bought is a 'PACE TF2000' which was at the lower cost end of the mar

BGA ball and PCB pad

Electronics Forum | Fri Feb 13 11:46:23 EST 2004 | Jack

Is your customer trying to reduce voiding? If the device is using Sn90 / Pb10 and the paste is Sn63/Pb37 the board will melt first. However, if both solders are 183C eutectic, it's a tossup? PCB design, copper weight, bga type (pbga, micro bga, Tbg

Conductive contamination and the elusive solution

Electronics Forum | Fri Jul 13 11:33:54 EDT 2007 | realchunks

Just starting and already responsible for product quality and machine adjustment? Wow, you poor bastard. Ok, I will assume this problem happens on the bottom side of the board with a thru-hole IC. The short occurs on the side that doesn't have the

Foam fluxer maintenance, storage and cleaning

Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef

Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept

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