Electronics Forum: micro bga tray (Page 2 of 50)

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Fri Aug 22 03:19:08 EDT 2008 | andrzej

Hi, what do you mean by collapsed ? Can you describe or send a photo ?

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Mon Aug 25 08:44:10 EDT 2008 | rameshr

Dear Andrezj, i had attached the photos for ur reference Kindly advice.

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Mon Aug 25 10:36:05 EDT 2008 | davef

Yes, it's peculiar that the layout of this board is so disorganized * Pads are not round, uniform, or the same size * Exposed traces have different thickness

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Wed Aug 27 00:20:38 EDT 2008 | rameshr

Dear davef, Will u pls advice what are all the possible defects caused while soldering ( assembling ) this type of boards.

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Wed Aug 27 08:25:24 EDT 2008 | davef

We'd expect to see: * Solder starved connections at pads with large trace/pad areas. * Less reliable solder connections at pads that do not match the shape and size of the corresponding pads on the component.

cost effective bga remove

Electronics Forum | Wed Mar 17 19:57:08 EST 2004 | Dreamsniper

Do you wanna save the BGA or what? Do you have an electric stove, baking tray and a BBQ clip? Does your wife love cooking? if u have one of each, then u don't need a reflow oven which is too expensive and you don't need to buy heating guns or drill p

Help for soldering mirco bga

Electronics Forum | Wed Oct 09 08:44:05 EDT 2002 | apg

Dear colleagues. I ask you to prompt me about necessity of drawing pastes through a stensil at the soldering micro BGA with step between leeds 1 mm and 0,8 mm or uses only a flux for this purpose. And what most suitable paste for the soldering of su

pcb design for bga grounding.

Electronics Forum | Thu Aug 12 10:49:22 EDT 1999 | Ray Hare

I am currently involved with designing a pcb which will use 225 pin bga,s The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is use the middle 6 or 7 rows of balls as the grounding,th

Re: looking for bga rework station

Electronics Forum | Sat Apr 10 10:01:43 EDT 1999 | Jeff Price

| | I am looking for a BGA rework/placement system and would like any experience that you have had. I am looking for a system that is reasonable for the placment, removing and re-balling | | | | thank you | | | -I have had wonderful results with

large bga (55mmx44mm) capable placement machines?

Electronics Forum | Fri Sep 10 09:00:40 EDT 2004 | rlackey

Hi, It should get you at least a 1997 machine, but the age isn't as critical as the UPS level - you want at least 3.2.3. They are good machines & are well built, and at least comparable with any other second user machines (although not in the Fuji/


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