Electronics Forum | Wed Feb 24 12:53:55 EST 1999 | Dave F
| Are the terms "uBGA" and "Fine Pitch BGA" synonomous, different all-together, or is Fine Pitch BGA a subset of uBGA? Thanks. | | Steve | Steve: �BGA�: Micro BGA�. A brand name for a fine pitch BGA from Tessera. Fine Pitch (1) In SMD: Surfa
Electronics Forum | Mon Aug 22 09:57:46 EDT 2005 | gavinscott
Hi All, The method that I use when training operators is.. a visual aid that shows the operators what way the trays are placed into the machine and the polarity of the component and also the component change logs. The matrix trays that I have delt w
Electronics Forum | Mon Aug 13 17:38:05 EDT 2001 | fmonette
Praveen, Once you find out the MS level of your components, you will need to track the exposure time from when the parts are initially removed from their dry bags, through test, programming, taping, and during subsequent dry storage and use of thes
Electronics Forum | Tue Sep 19 16:59:41 EDT 2006 | davef
BGA inspection microscope * sapltd.co.uk/electronic_production/bga_scope/bga_scope.htm * ocwhite.com/bga/ * hirox-usa.com/bga.html * jergensinc.com/infodir/catalog_asg.asp?GroupNum=175 * smttools.com/bga100.html * huntron.com/products/optilia/optili
Electronics Forum | Fri Jul 12 10:54:17 EDT 2002 | pr
Why not get them on tape and reel? I always found the less I use the trays the better.
Electronics Forum | Thu Jun 24 09:57:44 EDT 1999 | Vic Lau
Dear guys, I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now using a no
Electronics Forum | Thu Jun 24 10:11:33 EDT 1999 | Dave F
| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin
Electronics Forum | Thu Jun 24 16:19:46 EDT 1999 | Kennyv
| | Dear guys, | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are no
Electronics Forum | Thu Jun 24 16:23:18 EDT 1999 | Kennyv
| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin
Electronics Forum | Fri Mar 21 02:45:45 EST 2003 | emeto
Hi, there is one very important thing.How many boards came out with exatly the same problem?
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