Electronics Forum | Fri Mar 21 21:13:03 EST 2003 | iman
Russ, u mean excess flux causes "blow hole" defect?
Electronics Forum | Wed Jul 09 15:09:36 EDT 2003 | davef
Matt: What are we looking at in pix F2?
Electronics Forum | Wed Jul 09 16:05:46 EDT 2003 | davef
Sorry Matt. I mean the last row, second picture in from the left.
Electronics Forum | Tue Jan 17 11:51:05 EST 2006 | james
What about doing this method on Micro Bgas?
Electronics Forum | Sun Jun 28 17:07:13 EDT 2009 | mark_h
Thanks Dave, On first inspection it looks like it has a wealth of information...
Electronics Forum | Thu Jun 27 16:09:02 EDT 2013 | burstd
try yincae's SMT 158 capillary underfill. very easy reworking
Electronics Forum | Mon Sep 20 14:53:24 EDT 1999 | Doug
I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. The stencil is 6 mil thick, laser cut and electo-polished. The apertures are 12 mil in diameter with 20 mil pitch. We are using Alpha
Electronics Forum | Tue Aug 25 09:29:59 EDT 1998 | Richard Scarcelli
Would like to know the following information on processing micro bga's: 1) Fine mesh solder paste .vs. tacky flux --- which is best 2) Stencil thickness for solder screen 3) Aperature size for standard pitch balls 4) Which direction is the marke
Electronics Forum | Fri Sep 11 10:52:25 EDT 1998 | Javier Carrera
| Would like to know the following information on processing micro bga's: | 1) Fine mesh solder paste .vs. tacky flux --- which is best | 2) Stencil thickness for solder screen | 3) Aperature size for standard pitch balls | 4) Which direction is
Electronics Forum | Fri May 10 09:07:42 EDT 2002 | xrayhipp
Does anyone know a surefire way to print micro-vias which are centered on BGA pads and also reduces solder ballooning? Would you design a process around two stencils? -- one for the vias themselves and one for the pads. Could you fill all of the vi
