Electronics Forum | Thu Mar 11 17:33:01 EST 1999 | Scott
Kester is no longer in the equipment business. Robotic Process Systems (the orginal maker) is now selling and servicing the Micro wetting balances, Steam agers, and dip and look testers
Electronics Forum | Mon Jul 07 21:08:17 EDT 2003 | sam
I have an experience about AOI that it is necessary in a complicated PCB. Due to the final circuit design, the concerned PCB were having nets on the boards, that the Open/Short could not be identified by traditional In-Circuit testers. Some long tr
Electronics Forum | Fri Jan 05 10:15:55 EST 2007 | Cmiller
I have a customer working on a new design of a rather large board that needs to use a micro BGA that will require 8 layers. He needs to use that BGA and it does not come in any other package. He asked me about making the BGA an adapter or daughter bo
Electronics Forum | Thu Sep 09 21:50:53 EDT 1999 | kyung sam park
2 will have enormous impact on every other process. | | thank in advance. scott. I appreciate your sincere answer. would tell me the hint about printer if i's possible To tune our smt process we have to know what is the major X's for defect.
Electronics Forum | Thu Sep 09 22:18:13 EDT 1999 | Dave F
2 will have enormous impact on every other process. | | | thank in advance. | | | scott. | I appreciate your sincere answer. | would tell me the hint about printer if i's possible | To tune our smt process we have to know what is the major X
Electronics Forum | Fri Jan 03 12:12:22 EST 2003 | richard
Good day and thanks for your comments Mike, What did I understood from your notes� 1) ROSE test (�extracting solution�) is probably good enough (with good equipment) to penetrate the space under my micro BGA. 2) I should test 2 parallel batches of
Electronics Forum | Wed Oct 06 00:26:04 EDT 1999 | Karlin
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Wed Oct 06 08:41:42 EDT 1999 | Dave F
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Wed Oct 06 12:03:12 EDT 1999 | Graham Naisbitt
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Wed Oct 06 23:36:28 EDT 1999 | karlin
| | | Hi, | | | | | | Help! Could anyone help to enlighten me on this? | | | | | | Question: | | | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z
