Electronics Forum | Mon Feb 08 17:11:34 EST 2010 | woodsmt
Thanks Dave and Glenn, I have setteled on Dye for the destuctive checks, and was thinking about impedence testing at intervals during ESS. Based on the research I have been doing the last several days, this seems like a method that should identify
Electronics Forum | Mon Feb 08 09:03:49 EST 2010 | woodsmt
Looking for methods for detecting BGA microcracks without cross sectioning. Currently evaluating a new package and will be putting together a thermal stress eval. We would like to perform intermediate inspections for cracks. Once all cycles are don
Electronics Forum | Mon Feb 08 14:32:01 EST 2010 | davef
We believe that neither xray nor SAM will provide satisfactory results and that sectioning throughout the process will provide conclusive information.
Electronics Forum | Mon Feb 08 16:11:10 EST 2010 | glennster
Dave, I agree totally, but dye-and-pry should also be part of the evaluation. Glenn Robertson Process Sciences Inc
Electronics Forum | Mon Feb 08 20:09:49 EST 2010 | davef
Woody: Consider using test BGA with no chip in, but daisy chains that you can monitor. After soldering, run environmental tests and follow with electrical tests to determine if the product concept is good enough.
Electronics Forum | Mon Feb 08 23:44:31 EST 2010 | glennster
Woody, Daisy chain packages are definitely needed, but if you can get packages with a dummy chip inside these will provide a more accurate simulation of working components. If possible, continuous monitoring of resistance during the test will be
Electronics Forum | Wed Feb 10 12:15:40 EST 2010 | woodsmt
Daisy chained parts and impedence testing were my original reccomendation. Unfourtuantely I can not get the resources for this testing.
Electronics Forum | Thu Feb 11 08:14:41 EST 2010 | scottp
It's OK to have the daisychain done in the interposer rather than the die (and a lot cheaper) but in thermal cycling the parts MUST have representative die. That's where a large part of the CTE mismatch comes from to cause fatigue damage. Thermal c
Electronics Forum | Wed Jan 24 22:48:59 EST 2007 | frank63
Hello, we are facing some troubles with BGA opens in our production. PCB are both side popolated with BGA. BGA is array of 26*26, with some 6*6 center balls. PCB has 2 reflow processes, 4 pcs of BGA on each side. Now we are partly observing opens
Electronics Forum | Thu Dec 29 22:19:36 EST 2005 | Joseph
We have tested SN100C for LF wave soldering process since August'05 and currently start production for a month ago. Initially we use SAC305, but due to the shrinkage cavities (micro-crack) we changeover to SN100C. In summary, SN100C did perform well
