Electronics Forum | Mon Feb 08 20:09:49 EST 2010 | davef
Woody: Consider using test BGA with no chip in, but daisy chains that you can monitor. After soldering, run environmental tests and follow with electrical tests to determine if the product concept is good enough.
Electronics Forum | Sun Jul 05 22:21:58 EDT 2020 | raoult
Hi, The micro switch is broken on my device, it was a tactile one (4mm) : image1, image2 Do you think I can buy another one and just solder it like this with 2 wires (I can't solder it back to where it was because it's too tiny I don't have the sk
Electronics Forum | Wed Aug 27 08:25:24 EDT 2008 | davef
We'd expect to see: * Solder starved connections at pads with large trace/pad areas. * Less reliable solder connections at pads that do not match the shape and size of the corresponding pads on the component.
Electronics Forum | Mon Jul 06 16:46:39 EDT 2020 | emeto
If I was you, I would use solid copper wire and modify the new switch to have contacts same location and size as the old one. Then solder the same spot a s a full replacement.
Electronics Forum | Fri May 28 17:44:51 EDT 1999 | Glenn Robertson
| I discovered that we have some gold plated (30 mico in.) through hole connectors which were Paste In Hole soldered (60 sec at reflow) on a HASL PCB. Do we have an embrittlement reliability issue? The calculated volume % of gold in the joints is abo
Electronics Forum | Mon Jul 06 21:16:59 EDT 2020 | raoult
Thanks guys for your help. Sorry for the pic quality, the device is so small I had to zoom a lot with my phone. The switch is a tactile one, the plastic body is missing, and what you can see in the center is where the contact is made : when the swit
Electronics Forum | Wed Jul 08 16:01:46 EDT 2020 | raoult
up, thanks :)
Electronics Forum | Fri May 28 17:30:35 EDT 1999 | Dave Clements
I discovered that we have some gold plated (30 mico in.) through hole connectors which were Paste In Hole soldered (60 sec at reflow) on a HASL PCB. Do we have an embrittlement reliability issue? The calculated volume % of gold in the joints is about
Electronics Forum | Wed Aug 27 00:20:38 EDT 2008 | rameshr
Dear davef, Will u pls advice what are all the possible defects caused while soldering ( assembling ) this type of boards.
Electronics Forum | Fri Aug 22 00:20:29 EDT 2008 | rameshr
Hai, In our process we are using the micro bga of size 13X13mm of pitch 0.45mm,after soldering process the bga found collapsed, we absorbed that the PCB land pattern of the BGA was not in array, uneven distribution of pads (area) & most of the pads
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