Electronics Forum: microe (Page 1 of 88)

micro assembly technology inc. dispensing at 20um resolution

Electronics Forum | Thu Nov 18 02:53:31 EST 2004 | galp

Chack this contact "micro Assembly technology" tel: +972-4-9592225

Micro BGA baking

Electronics Forum | Fri Aug 10 02:30:46 EDT 2001 | praveen

Hello Friends, Please advise how critical is the Micro BGA baking? The BGA size is around 7x7mm and we need to program it before mounting. The Micro BGA's are supplied in Trays and are put in to tape and reel after programming.We need to put these BG

Gold Thickness

Electronics Forum | Fri Jun 09 08:20:56 EDT 2006 | kehoem@bellsouth.net

We have a board calling out for 50 micro-inches of nickel over 30 micro-inches of gold. This is a solid gold board on Rogers material. ENIG cannot be deposited that thick right? Electroplated gold (we thought) was usually 35-50 micro-inches and was

Aperture size for Micro BGA stencil

Electronics Forum | Thu Jun 22 10:27:26 EDT 2000 | Igmar

Can someone please help with the aperture size on a Micro BGA stencil. I want to have an electroformed stencil made with 0.1mm (4mil) thickness. The PCB pad for the micro BGA has a 0.406mm (16mil) diameter. What size should I make the apertures for t

MicroFlex

Electronics Forum | Mon Mar 08 16:16:53 EST 2004 | Daniele

I have got information that MicroFlex (re-engineered version Ultraprint) screen printer from MPM can handle with 0.3mm fine pitch. Does any one make 0.3 mm print test?. What is the effectivnes MicroFlex for 0.3 fine pitch and is it reliability proces

Micro crack for lead free wave solder

Electronics Forum | Mon Aug 01 06:59:02 EDT 2005 | Joseph

Dear all, We observed visible micro crack at top side of solder fillet during lead free wave solder process. We did not see any visible micro crack at bottom side, and it always located at joints of transformer. Any input be much appreciated. Best

Micro Solder Balls in No Clean Selective Solder Process

Electronics Forum | Wed Jan 09 13:39:48 EST 2008 | ck_the_flip

Mask finish is the #1 variable for micro-balling with wave and selective processes. The #2 variable is the Flux. There are some flux formulations out there who're known to have additives that virtually eliminate micro-balling. However, keep in min

Gold surface contam after prebake 150C for 3 hrs

Electronics Forum | Thu Aug 05 18:21:16 EDT 2004 | davef

Well, it could be the beautiful Jill Masterson, as Goldfinger's trusted card advisor Shirley Eaton, who gave new meaning to the phrase "golden girl." Or more mundanely, gold thickness usually ends-up: * Gold fingers (10 to 100 micro-inches) * Selec

MicroBGA Footprint

Electronics Forum | Thu May 31 22:47:23 EDT 2007 | alaniesubiron

thanks for the input...

Re: Micro BGA

Electronics Forum | Mon Jun 12 09:49:02 EDT 2000 | Huss Akbar

I'm trying to get more info on the basics of micro bga's and also electrofoaming--links and /or websites would be much appreciated. thks

  1 2 3 4 5 6 7 8 9 10 Next

microe searches for Companies, Equipment, Machines, Suppliers & Information



Reflow Soldering 101 Training Course
Void Free Reflow Soldering

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
SMT feeders

World's Best Reflow Oven Customizable for Unique Applications
Circuit Board, PCB Assembly & electronics manufacturing service provider

Wave Soldering 101 Training Course
Electronic Solutions R3

Thermal Transfer Materials.