Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
Electronics Forum | Wed Apr 21 13:52:34 EDT 1999 | Steve Gregory
Technically speaking, there is nothing for me to say. Oh maybe just one thing - to get me back into the fray: Steve, I must say I totally disagree with your assessment of under screen cleaners. I have had nothing but excellent results using the dry,
Electronics Forum | Wed Apr 21 18:58:44 EDT 1999 | Earl Moon
| Technically speaking, there is nothing for me to say. Oh maybe just one thing - to get me back into the fray: Steve, I must say I totally disagree with your assessment of under screen cleaners. I have had nothing but excellent results using the dr
Electronics Forum | Wed May 08 23:18:58 EDT 2002 | ianchan
Hi mates, have this SMT production issue : A) We have a leadless-chip-carrier(LCC) IC package that is classified under the Land-Grid-Array(LGA) package family. B) The LCC is 4mm x 4mm, and has 28 tin plated pads located beneath the outside perimet
