Electronics Forum | Wed Mar 01 07:45:56 EST 2006 | davef
Consider: * Equipment Inspection acoustic microscope [Scanning Acoustic Microscopy (SAM)] MicroPhotonics 4949 Liberty Lane, Suite 160, PO Box 3129 Allentown PA 18106 610.366.7103 fax 7105 http://www.microphotonics.com * Equipment Inspection acoustic
Electronics Forum | Mon Jan 21 16:02:41 EST 2008 | rayjr1491
hi dave Is there another tool besides SAM (Scanning Acoustic Microscopy)? Regards, Ray
Electronics Forum | Thu May 01 17:25:10 EDT 2003 | davef
Our first choice in determining the composition of metals would be to use Scanning Electron Microscopy (SEM) / Energy Dispersive Spectroscopy (EDS) analysis.
Electronics Forum | Mon Nov 13 20:55:11 EST 2000 | Dave F
Not too much to go on, bud. Tell us about: * Wire material, finish, insultation, etc * Wetting problem description * Why feed that the wire is used for through is important * Range and extent of the problem * Results of metallographic analysis of "g
Electronics Forum | Mon Jul 30 21:10:32 EDT 2001 | davef
The 5DX weighs 8000 pounds. Can your product bear the overhead? We use acoustic microscopy to find BGA opens. We have not had good luck finding opens with other inspection technology. Has Agilent told you that you can detect BGA opens? How is th
Electronics Forum | Wed Mar 04 13:06:45 EST 2015 | cyber_wolf
A full blown analysis could become very expensive. There are many test that can be performed. 3D acoustic microscopy, X-ray, Dye and pry,and I'm sure the list goes on. Typically, a micro-cross section report of the BGA solder joints will show you w
Electronics Forum | Tue Jun 19 11:57:35 EDT 2001 | Gil Zweig
As you probably know, x-ray inspection has problems positivly identifying cracks or delamination. This task is more suited to scanning laser acoustical microscopy but the cost is very high. It has been our experience that cracks are associated with t
Electronics Forum | Sat Jul 02 08:01:37 EDT 2005 | davef
Comments are: * A good looking solder ball does not necessarily mean that you have a good solder connection between the ball and the pad. We've all seen a bright and shiney solder ball on the floor, but that doesn't mean there's a good metalurgical
Electronics Forum | Wed Apr 26 02:16:18 EDT 2006 | AR
We had x-ray and optical microscopy analyses done on transformers dip soldered with Sn/Pb, SN100C3 and SN100C4 alloys using temperatures 400�C ... 450 �C, with dip times of 2..4 seconds. We found that SN100C4 is at least as good as Sn/Pb 62/38 and SN
Electronics Forum | Wed Dec 14 23:32:19 EST 2005 | jhernan9
Hi, I'm having a lot of problems with BGA's shorts, we are using 0.005" stencil aperture 1 to 1 (0.014)", the paste is centre (I can not measured the height)was verified using electronic microscopie, the placement is centre (I'm using local fiducials
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