Electronics Forum | Sun Apr 15 23:12:00 EDT 2001 | Eric Chua
The size i had changed from 55 x 20 mils to 42 x 20 mils. The component size i have is 40 x 20 mils ( 1mm x 0.5mm ).
Electronics Forum | Thu Jan 13 12:22:32 EST 2000 | Dave F
Abbas: For IPC specs: Go to ipc.org For MIL specs: Go to dscc.dla.mil Good luck Dave F
Electronics Forum | Fri Jul 31 17:21:38 EDT 1998 | MMurphy
31 mil pitch components go either 1:1 or reduce 1 mil per side (you can reduce further if the foil thickness is > 7 mil.), you may want to try an oval shape here also.
Electronics Forum | Fri Jul 31 17:23:11 EDT 1998 | MMurphy
31 mil pitch components go either 1:1 or reduce 1 mil per side (you can reduce further if the foil thickness is > 7 mil.), you may want to try an oval shape here also.
Electronics Forum | Fri Jul 31 17:24:12 EDT 1998 | MMurphy
31 mil pitch components go either 1:1 or reduce 1 mil per side (you can reduce further if the foil thickness is > 7 mil.), you may want to try an oval shape here also.
Electronics Forum | Wed Aug 05 07:44:18 EDT 1998 | Joe Vella Ottosen
31 mil pitch components go either 1:1 or reduce 1 mil per side (you can reduce further if the foil thickness is > 7 mil.), you may want to try an oval shape here also.
Electronics Forum | Fri Sep 21 01:31:13 EDT 2001 | Stoney Tsai
Guys, If there are any specifications or ciriterions for solder paste deposition thickness and volume evaluation. For example, QFP (0.5 mm pitch), 6~8 mils, 3000 mil^3 PLCC: 8~10 mils, ... . . Thanks in advance. Best Regards,
Electronics Forum | Thu Sep 12 01:49:28 EDT 2002 | ck
Hi all, Any stencil opening recommendation for 20mils pitch mirco BGA. Currently, using 12mils round opening, 5 mils thickness. Seen to have weak joints as it crack after Ict testing. thks
Electronics Forum | Fri Apr 08 19:55:48 EDT 2005 | Dhanish
The problem is IPC spec. calls for 7 mils/inch but my equipment spec. calls for Warpage as 40 mils.Our Equipment folks saying if a board warps more than 40 mils ,there will be placement issue.
Electronics Forum | Mon Apr 11 01:47:08 EDT 2005 | Dhanish
The problem that I am facing is the Equipment Engieer refuse to run this lot as the boards warp as high as 60 mils but the machine spec.call max 40 mils warpage.The boards length is 16 inches and the thickness is 93 mils.The supplier feedback this is
