Electronics Forum | Thu Jul 27 14:48:26 EDT 2000 | Bob Barr
Is Mil-I-46058 still an active spec or has it been obsoleted by the Feds in favor of IPC specs? I have an internal process document that is based on IPC requirements, but a customer wants me to use their specs that are based on the mil spec. I am ho
Electronics Forum | Mon Mar 20 10:54:36 EST 2000 | Glenn Robertson
Jack - The last time I checked IBM was specifying a minimum of 4800 cubic mils of paste for each pad. This is required for acceptable reliability, not just to make the connection. There is no way you are getting that volume with a 5 mil stencil
Electronics Forum | Sun Jun 10 11:08:26 EDT 2001 | nifhail
I know that there is no pre-defined strength for the solder joint as it will depend on solder volume deposited, pad geometry, lead component's lead solderability etc. but, what would be the best ball park for the good joint for 0402, 0603, 20 mil pti
Electronics Forum | Thu Oct 07 12:17:09 EDT 1999 | Bob Barr
The last time I worked with this spec (and it has been a while) it was MIL-C-28809, not 'P'. Try searching for that. There is a good chance this document has been obsoleted in favor of an IPC spec. Good luck. Bob | Is anyone aware of a web pag
Electronics Forum | Mon Sep 20 14:53:24 EDT 1999 | Doug
I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. The stencil is 6 mil thick, laser cut and electo-polished. The apertures are 12 mil in diameter with 20 mil pitch. We are using Alpha
Electronics Forum | Tue Sep 29 18:05:21 EDT 1998 | Kallol Chakraborty
Anyone have ideas how to get MIL 50884 Qualification?. We are a small/mid sized Flex, rigid-flex circuit shop in Canada considering MIL Qualification. Is there any web site that we could check out? any advice is appreciated. thank you. Regards Kc.
Electronics Forum | Thu Aug 30 13:43:33 EDT 2001 | jseagle
I know that Contact says it will do it but I am having difficulties placing a 20 mil TSOP with consistant results so I don't really trust how well it will be able to place a 15 mil QFP. The part is going to be used on every board we produce, average
Electronics Forum | Tue Feb 12 10:33:45 EST 2002 | davef
IPC-4101 - Specification For Base Materials For Rigid And Multilayer Boards replaces MIL-P-13949 - Plastic Sheet, Laminated, Copper-Clad (For Printed Wiring) Taking a broader look, there are many �Obsolete MIL Document To Commercial Document� replac
Electronics Forum | Wed Sep 18 06:53:05 EDT 2002 | CH
1) For solder short, pls check the paste height. Too much vol will cause short. For 15 mils use 5 mils thickness stencil if possible. Check profile preheat time to prevent hot slumpof the paste. 2) type 4 powder will be better for 15 mils pit
Electronics Forum | Tue Mar 02 10:24:06 EST 2004 | russ
I have done this before, We print with a 5-6mil stencil and have had no problems with any underneath solder. If you are still nervous instead of removing from stencil use some 3 mil kapton tape or equivelant and tape off the BGA pads. This way the
