Electronics Forum | Fri Jan 14 11:16:45 EST 2005 | Dan Gosselin
I have heard of people using a round pad or Home plate design to decrease the incidence of tombstoning on 0402's Anyone have any practical experience on this or is everyone just using the IPC 782 recommended land pattern (28mil x 33mil rectangle pad
Electronics Forum | Wed Oct 26 14:29:55 EDT 2005 | barryg
We have a class 3 assembly we will be doing soon and I was wandering since the fillet heighth required for class 3 is 50% more than class 2, should I have my stencil thickness increased from 6 mil. to 7 mil.? This assembly is made up of 31 mil. pitch
Electronics Forum | Thu Jun 01 21:19:52 EDT 2006 | ec
Hi Russ, Thanks for your input. Currently, our stencil is at 5 mil thickness and the paste height from 5.5 to 6.5mil. I have increase the paste height to 7 to 7.5 mil and great improve....... I just need some data to present to my management and tel
Electronics Forum | Tue Aug 01 18:39:24 EDT 2006 | G.P.
I'm in 100% agreement with the 5 mils foil. In applications where there is less than 20 mil pitch actives and less than 0603 discretes 5 mils does great and increases your operating window by a ton it's less sensitive to release and print accuraccy.
Electronics Forum | Thu Feb 08 14:55:30 EST 2007 | pavel_murtishev
Good evening, I do. 2mil overprint is not critical. Paste will simply flow back. Paste flows back even with larger overprint (up to 15mil at least). 5mil stencil thickness if fine also. BGA area ratio for both BGAs is higher than 0.66 required by IP
Electronics Forum | Tue Mar 27 08:49:57 EDT 2007 | slthomas
If by 15 mil accuracy you're looking to place 15 or 16 mil pitch, yeah, you're asking a lot of a IVc. Ours do OK for 20 mil pitch but I wouldn't want my living to depend on placing high volume ultra fine pitch with it. They're not designed for that.
Electronics Forum | Tue Sep 16 10:51:09 EDT 2008 | rayjr1491
Here is the scenario: We are using Lead Free Type III paste. We are using 5 Mil EFORM stencils The part we are having issues with is a SOT883. Stencil design is the SMALL PADs are 10x16mil Large PAD 14 x 24 mil. We are getting some see-sawing of th
Electronics Forum | Tue Sep 16 13:40:20 EDT 2008 | ck_the_flip
Try reductions in the "Y direction". For the SMALL PAD, go from 16-mils to 14-mils, and on the large pad, you can play around with reductions on the 14x24mil pad...or try mesh pattern. You'll be well with area-ratio guidelines with both approaches,
Electronics Forum | Mon May 24 13:11:12 EDT 2010 | deanm
A guideline that I use agrees with MikeS: For 20mil pitch, apertures should be 9-10mil with a stencil thickness of 5-6mils to achieve an acceptable aspect ratio of 1.7. Just be sure you are using a mesh Type 3 or 4 solder paste. Otherwise, larger par
Electronics Forum | Fri May 16 17:15:16 EDT 2014 | edwardt
Desire to push the spacing limit as usual. If I place two 0402 components spaced 7mils between the edge of the two components adjacent pads, which allows for 4mils solder mask webbing between component pads, what would the risk be? Potential for sold
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