Electronics Forum | Tue Oct 28 18:58:05 EDT 2014 | rangarajd
You might want to consider using a stepped stencil. We have tried using a 5 mils with an increased aperture size to compensate for the lost solder volume, if you were to use a 6 mils. While the yield was good, we'd still get random opens. With a 6 m
Electronics Forum | Mon Dec 02 08:43:20 EST 2019 | scotceltic
What are people using out there for minimum spacing between vias ? We recently came across a PCB manufacturer that wants us to increase our spacing due to their process. Below is our current spec. that we follow. Spacing between via pad to via pad o
Electronics Forum | Thu Feb 24 11:05:53 EST 2000 | Russ
I usuallly like to have the pad size the same size as the ball up to +2mil, the pcb solder mask opening to be +4 mil from the pad size (I have found this to aid in Xray inspection for opens since you can see the little tail of the solder wicking up t
Electronics Forum | Mon Nov 13 04:57:27 EST 2000 | Wolfgang Busko
Hi Richard, I assume that you deal with a component that has 20mil pitch. In this case depending on your pad design you get from 8 to 10mil spacing for your apertures. With a slight reduction of the aperture (10 to 15% for avoiding shorts)and a 6mil
Electronics Forum | Thu Sep 30 06:47:51 EDT 1999 | park kyung sam
| My stencil thickness is 6 mil and we got qfp's with fine pitch. | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | thanks | we have placed 16 mil components for 3 years. why don't
Electronics Forum | Mon Feb 23 15:10:02 EST 1998 | justin medernach
| Stencil Opening | Looking for spec or any info to specify stencil opening for TSOP48 20mil that will consider also thickens and direction of printing, if applicable Ron, Use a six mil foil thickness for your stencil. Go one to one with your apert
Electronics Forum | Tue Jun 17 08:52:39 EDT 2003 | russ
Aspect ratio = width of aperture divided by height. E.G. 6 mil stencil at 9 mil wide = aspect ratio of 1.5. Value should be 1.5 min. Area ratio - use when length and width of pad are roughly same dimension like for BGAs and 0805 and smaller R-nets
Electronics Forum | Thu Sep 01 18:27:28 EDT 2005 | Board House
Hi I currently Manufacture product for Dataradio Inc. in Quebec. and would be interested in quoting your product. We are a Multi-layer facility in Minnesota, we currenty manufacture layer counts between 2 & 18 layers. Line widths and Spacing down t
Electronics Forum | Tue Jan 02 14:15:59 EST 2007 | realchunks
I have a new customer that has a print calling for 2oz. copper finish for top and bottom layers, and 1oz. copper finish for the inner 6 layers. Now, they also have a stack up depicting each layer and thickness. It shows the outer layers of copper b
Electronics Forum | Thu Mar 29 12:05:38 EDT 2007 | cecil
OK, just finished our prototype build. PWB 7.5" x 10" 16 layers smallest pitch 17mil smallest BGA pitch 30mil (round apertures) smallest component 0402 total of 1492 placements 5 mil stencil foil (invar) Had numerous PQFN packages that always gave