Electronics Forum | Wed Jun 06 02:57:37 EDT 2001 | kyaw
I have a problem run in Burn-in-Board that the sockets lead are deform and lifted about 6 mil to 10 mil from PCBA. Anybody can inform to me for this problem. Thank you
Electronics Forum | Tue Jun 19 18:18:31 EDT 2001 | davef
You can make this as complicated as you'd like. Look at: http://fcim.dscc.dla.mil/Programs/MilSpec/default.asp?DocTYPE=PRF
Electronics Forum | Tue Jan 11 21:03:23 EST 2000 | abbas
Dave, With same hand, Can you give me some references/readilly available info. on IPC/MIL standards for PCB design,fabrication and assembly.Web searching is little bit tough job to me specially. Thanks in advance / Abbas
Electronics Forum | Fri Oct 22 17:15:58 EDT 1999 | Parvez Patel
Hi, I am trying to locate any vendor who can supply me some 28 mil * 28 mil matrix tray feeders for test component storage Thanks Parvez Patel SMT Lab UIC - Binghamton - New York
Electronics Forum | Thu Oct 07 07:57:27 EDT 1999 | Mike Demos
Is anyone aware of a web page for military spec's? I am looking for Mil-P-28809. Thanks, Mike Demos
Electronics Forum | Thu Oct 07 07:57:08 EDT 1999 | Mike Demos
Is anyone aware of a web page for military spec's? I am looking for Mil-P-28809. Thanks, Mike Demos
Electronics Forum | Mon Sep 20 20:51:36 EDT 1999 | Greg H.
My stencil thickness is 6 mil and we got qfp's with fine pitch. how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? thanks
Electronics Forum | Tue Feb 23 09:51:35 EST 1999 | Steve Schrader
| Hey all- | | My question is this: My stencil printer operator has said that he has to | wipe our 6-mil stencil each pass to get the paste in the 20-mill pitch | aperatures for a QFP to release well. We are using Amtech NC-559 type 3 | paste with
Electronics Forum | Fri Feb 05 21:34:25 EST 1999 | Raymond Bellamy
I am looking for a piece of equipement that can safely remove silicon die(200mil by 200mils) from a LTCC board. My present method involves a dental drill which often goes through the dielectric layers and causes scrap.
Electronics Forum | Thu Jan 21 16:00:42 EST 1999 | Derek Drabenstadt
I'm currently planning to do an evaluation of RMA flux solder pastes for mil type applications. Does anyone have any suggestions for vendors to try? I'm especailly interested in pastes that aid application on boards with 20 mil pitch.
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