Electronics Forum: mil-p-28809 cleanliness requirement (Page 8 of 14)

wave solder machine

Electronics Forum | Tue May 17 10:11:54 EDT 2005 | russ

I would use a foam fluxer since spraying rosin will make the stickiest nastiest mess you can imagine. 18 layer board huh? You will want convection preheat, both top and bottom preheaters, preheat tunnel of at least 4-5', a chip wave, laminar flow w

IPC Questions........

Electronics Forum | Wed Aug 30 07:45:08 EDT 2006 | davef

18-30*C, 30-70%RH * Particle count: ** Institute of Environmental Science and Technology (IEST) sets up the criteria and measurement methods to determine cleanroom class [eg, 10, 100, 1000, etc]. Consult their web site and perhaps take one of their

DI water testing?

Electronics Forum | Tue Aug 28 11:54:25 EDT 2007 | rgduval

Dave, To tell you the truth, I couldn't tell you. I came into this company with the system installed. When the resistivity is depleted, I call Culligan. It may only be an in-line cartridge filter that they change. We've noted a change in water q

Looks like we'll be BGAing in the near future

Electronics Forum | Wed Feb 06 14:36:07 EST 2008 | dphilbrick

We had a customer that had 5 BGA's top and 2 bottom and several other assemblies that had 4-7 total BGA's that required WS. Our average build quantity was 2200 boards a month. We used high end Maytag dishwashers and a little Amterge(SP?) Took them t

Solder mask and fine pitch devices

Electronics Forum | Tue Jan 08 09:23:18 EST 2013 | lock_2002

This is a question regarding soldermask between pins of fine pitch devices. The majority of our production designs end up with at least 2-3 mils of copper thickness on the external layers due to blind vias, wrap plating requirements, etc. Our curre

No Clean

Electronics Forum | Tue Jun 12 18:06:17 EDT 2001 | davef

The criterion you use will depend on the test method you select. For minimum requirements, look at J-STD-001C, Para 8, "Cleanliness Requirements". I figure that you�d measure the residues on a lot of your current product, measure the res on a lot o

External Factors to be controlled during assembly

Electronics Forum | Thu Sep 27 19:52:28 EDT 2001 | davef

All of the discussion of "environmental controls" are a matter of degree, dependent on the requirements of the product that you manufacture. For example: shops assembling under-the-hood products have different requirements than shops making garage d

Re: Things I Like Without Endorsing

Electronics Forum | Wed Jun 02 23:53:09 EDT 1999 | Dean

| To you all for comment and summary, | | The following things I like without endorsing (PCB/PCBA stuff - outside the great women in my life [many] and without [mostly]): | | 1) A good set of design rules | 2) A good set of design rules meeting pro

SMT Lines' Facilities Requirement

Electronics Forum | Thu Sep 29 10:21:11 EDT 2011 | davef

1. Floor loading requirement - The designer of your factory building specified the flooring with a certain floor loading capability. You need to determine that capability. You plan to install machines and equipment. You need to determine the weight o

Contamination test

Electronics Forum | Mon Jul 30 21:03:44 EDT 2001 | davef

You should specify the level of res based on the effect of the res on the end-use of the product. J-STD-001 defines cleanliness requirements for ALL flux types, including water soluble and no-clean that you mention. 1 There is no equivalency betwee


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