mil-std-883c dt.25/08/83 products, companies, forum discussions and technical articles 1 mil-std-883c dt.25/08/83 result

Electronics Forum: mil-std-883c dt.25/08/83 (Page 1 of 1)

Plating for aluminum wire bonding

Electronics Forum | Tue May 13 21:08:24 EDT 2003 | ramanandkini

Dear Sir, Sorry for the delay in reply. This is regarding MIL standard for bond pull strength: MIL-STD-883C dt.25/08/83 Bond strength (destructive bond pull test); refer table-1 Minimum bond strengths for various wire composition & diameter given.

  1  

mil-std-883c dt.25/08/83 searches for Companies, Equipment, Machines, Suppliers & Information

See Your 2024 IPC Certification Training Schedule for Eptac

Stencil Printing 101 Training Course
PCB Handling Machine with CE

Wave Soldering 101 Training Course
PCB Handling with CE

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Voidless Reflow Soldering

World's Best Reflow Oven Customizable for Unique Applications