Electronics Forum | Wed Nov 07 20:01:35 EST 2007 | davef
Josh: Hole size to lead diameter ratio is meaningless. Minimum and maximum component lead to finished hole size clearance do not vary according to component lead diameter or hole size. Regardless, here's what you want to smack those goofballs over i
Electronics Forum | Thu Sep 23 10:48:21 EDT 2004 | Mke
Hi, My experience in the past has been predominantly with Fuji, Universal and Siemens. I categorise each of these systems in different ways; 1) If I want bombproof reliability - I Choose fuji. There tough mechanical design ensures operation time
Electronics Forum | Wed Jun 23 18:23:32 EDT 1999 | Tom B.
Even though you may find a pad-pad thru-hole spacing, part body size, orientation, and insertion head tooling clearences may be the deciding factor in spacing. 1. Part body diameter will dictate component centroid spacing. ---[][][][
Electronics Forum | Wed Jun 11 16:30:33 EDT 2003 | T.Vick
You have received some great feedback so far. I would like to summarize and add a few points regarding maintenance. You should start (as recommended already) by verifying your component library data. Using the default values from the master library i
Electronics Forum | Tue Oct 05 04:01:36 EDT 1999 | Brian
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Wed Nov 01 07:32:33 EST 2006 | davef
What you have run up against is the unfortunate consequence of the transition period from Sn-Pb to Pb-free. In the past 2-3 years there have been several studies highlighting the differences in reliability between mixed metal systems, Sn/Pb, and SAC
Electronics Forum | Tue Mar 12 10:16:05 EDT 2013 | bocci572
Yes the components are flat and no larger than 50mm in size. Most are full rings or just an arc of a ring. I understand fully the best way to have the capabilities proven would be to have the vendor demonstrate. I am kind of looking at what people
Electronics Forum | Fri Jun 23 12:30:24 EDT 2000 | Super K (Evil K)
To answer Gary's question: Gary, you will need a production board, thermal profiler, flux vendors product data sheet on the flux you intend to use, maybe your wave vendor service engineer or wave solder vendor contact (unless you know your wave) and
Electronics Forum | Fri Jun 23 12:32:20 EDT 2000 | Super K (Evil K)
To answer Gary's question: Gary, you will need a production board, thermal profiler, flux vendors product data sheet on the flux you intend to use, maybe your wave vendor service engineer or wave solder vendor contact (unless you know your wave) and
Electronics Forum | Fri Nov 01 09:35:52 EST 2002 | James Bartlett
MINIMUM NDSU EMEG EQUIPMENT SPECIFICATIONS (11/1/02) To serve microsensor research and development via the Center for Nano-scale Science and Engineering (CNSE), the North Dakota State University (NDSU) Electronics Manufacturing Engineering Group (EM
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