Electronics Forum | Wed Sep 12 03:52:45 EDT 2018 | shascoet29
Hi, Is the IPC-A-610 applicable to CSP assemblies? Especially regarding the solder ball to solder ball distance versus the minimum electrical clearance for assembly(0.13mm/IPC-A-610). With a 0.4mm pitch component and 260 microns diameters balls, thi
Electronics Forum | Tue Jun 06 11:57:12 EDT 2006 | Chunks
IPC 610 says acceptable Class 1 (Class 2, 3 indicator) if they are entrapped/encpsulated balls within 0.13mm of lands or pads. or exceed 0.13mm in diameter. Defect Class 1,2,3: Solder ball violates min electrical clearance. Solder balls not entrap
Electronics Forum | Tue Apr 23 14:30:35 EDT 2019 | scotceltic
I would like to setup a guideline for BGA to components around it minimum distance. To allow for rework possibilities of the BGA. What are people using as a minimum clearance out there ?
Electronics Forum | Thu Apr 25 17:17:44 EDT 2019 | spitkis2
Years ago it was common to see 2-3mm keep out areas around BGAs. Now with boards being so densely populated there are no clearance minimums. Regardless if the machine is using convection or IR heating, parts can be reworked without affecting adjace
Electronics Forum | Thu Apr 25 05:17:08 EDT 2019 | pdrirrework
Hello All, Using IR will mean that there is no minimum distance to the adjacent components as there is not hot air flow. If components are heat sensitive around the BGA you can also tape them off with a reflective tape. The IR heat will bounce strai
Electronics Forum | Mon Jun 20 09:12:55 EDT 2005 | davef
There's no easy answer. It depends on: * Thickness and size of the PCB in the array. * Means of separation. * Type of component. SMT components are more sensitive to the forces that need to be applied to separate the PCB. * Type SMT device. Ceram
Electronics Forum | Thu May 26 21:04:04 EDT 2005 | thaqalain
What is electrical clearance?
Electronics Forum | Fri Aug 26 17:27:48 EDT 2005 | saragorcos
Hello there, Most probably, since the solder balls are entrapped, it is a process indicator, but refer to IPC 610-6.5.3.1 on Excess solder / solder balls / splashes - it really depends on what class you are manufacturing, and the minimum electrical c
Electronics Forum | Thu Jan 31 13:01:33 EST 2013 | kmots15
Defect if its not coated. Defect - Class 1,2,3 • Solder balls are not entrapped, encapsulated or attached or can become dislodged in the normal service environment. • Solder balls violate minimum electrical clearance.
Electronics Forum | Wed Jan 01 22:19:33 EST 2020 | sssamw
Solder ball attached on solder joint without violation minimum electrical clearance is acceptable. If your process parameter including stencil not changed, suggest you check if solder pasted being pushed out after IC placement, also check if solder j
