Electronics Forum | Wed Sep 12 03:52:45 EDT 2018 | shascoet29
Hi, Is the IPC-A-610 applicable to CSP assemblies? Especially regarding the solder ball to solder ball distance versus the minimum electrical clearance for assembly(0.13mm/IPC-A-610). With a 0.4mm pitch component and 260 microns diameters balls, thi
Electronics Forum | Tue Jun 06 11:57:12 EDT 2006 | Chunks
IPC 610 says acceptable Class 1 (Class 2, 3 indicator) if they are entrapped/encpsulated balls within 0.13mm of lands or pads. or exceed 0.13mm in diameter. Defect Class 1,2,3: Solder ball violates min electrical clearance. Solder balls not entrap
Electronics Forum | Mon Jun 20 09:12:55 EDT 2005 | davef
There's no easy answer. It depends on: * Thickness and size of the PCB in the array. * Means of separation. * Type of component. SMT components are more sensitive to the forces that need to be applied to separate the PCB. * Type SMT device. Ceram
Electronics Forum | Wed May 03 11:17:25 EDT 2006 | aj
Guys, What DFM is standard for Minimum Edge Clearance on a PCB for Fiducials and components? Any advice appreciated. aj...
Electronics Forum | Fri Aug 26 17:27:48 EDT 2005 | saragorcos
Hello there, Most probably, since the solder balls are entrapped, it is a process indicator, but refer to IPC 610-6.5.3.1 on Excess solder / solder balls / splashes - it really depends on what class you are manufacturing, and the minimum electrical c
Electronics Forum | Thu Jan 31 13:01:33 EST 2013 | kmots15
Defect if its not coated. Defect - Class 1,2,3 • Solder balls are not entrapped, encapsulated or attached or can become dislodged in the normal service environment. • Solder balls violate minimum electrical clearance.
Electronics Forum | Wed Jan 01 22:19:33 EST 2020 | sssamw
Solder ball attached on solder joint without violation minimum electrical clearance is acceptable. If your process parameter including stencil not changed, suggest you check if solder pasted being pushed out after IC placement, also check if solder j
Electronics Forum | Thu Nov 08 19:56:08 EST 2007 | davef
Josh: Your 0.009" [0.228 mm] clearance should be fine. The minimum clearance should be ~0.008" [0.20 mm]. Is the 0.039" [0.99 mm] the measured or the expected hole diameter? While we wouldn't like it, we wouldn't be surprised to see 0.008" [0.20 mm
Electronics Forum | Mon Apr 29 02:50:03 EDT 2002 | Bob Willis
The basic guidline is lead size plus 0.010" which you can also use for through hole reflow/intrusive reflow. Most suppliers of the insertion equipment quote this as the minimum clearance hence its a good guide. Druing recent trials for through hole
Electronics Forum | Wed May 05 09:23:11 EDT 2004 | InterConn
Hi ACE, I design with a Minimum of 0.40mm Body to Body on 0805 Chip size down for hi volumne products, 0.60mm would be preferred. Regards I/C
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