Electronics Forum | Thu Sep 20 14:20:46 EDT 2012 | blnorman
From what I was told, gold flash normally refers to 10 microinches of gold.
Electronics Forum | Fri Sep 21 10:35:37 EDT 2012 | davef
Flash gold is just thin electrolytic gold plating over electroless nickel or electrolytic nickel. Flash gold plating ... * Less than 3 microinch thick will be porous and take solder poorly * Greater than 10 microinch thick will cause brittle solder c
Electronics Forum | Thu Sep 20 10:05:35 EDT 2012 | guyramsey
What is the state of the art in electroplated gold flash a a surface finish; thickness and tolerance limits?
Electronics Forum | Mon Sep 24 10:07:46 EDT 2012 | eezday
The answer, as stated above, is 3 microinch's however, it is equaly important, if not more important, to understand that the only function of the gold is to protect the surfaces beneath it. Only enough gold to cover the nickel beneath it should be u
Electronics Forum | Thu Oct 07 20:34:48 EDT 1999 | Tony Huang
Hi, Does anybody know what is the minimum gold plating thickness on the PCB goldfinger required by the industrial specifications - IPC, Bellcore, etc. Where can I find the information? Appreciate for the help! Thanks, Tony
Electronics Forum | Fri Oct 08 17:12:31 EDT 1999 | Dave F
| Hi, | | Does anybody know what is the minimum gold plating thickness on the PCB goldfinger required by the industrial specifications - IPC, Bellcore, etc. Where can I find the information? Appreciate for the help! | | Thanks, | Tony | Hi Tony:
Electronics Forum | Mon Aug 16 18:09:33 EDT 2004 | Kris
ok I agree there has been a confusion with terminology When you say electrolytic soft gold with a minimum thickness of 5-8 of Au, is there a standard that you spec this from ?
Electronics Forum | Mon Aug 16 20:32:10 EDT 2004 | davef
First, we didn't say "electrolytic soft gold with a minimum thickness of 5-8 of Au". We said, "'electrolytic soft gold' thickness 5 to 8uin". FOCUS. ;-) Second, we're unaware of an industry accepted specification that you can reference. IPC-2221
Electronics Forum | Fri May 24 09:16:36 EDT 2013 | grahamcooper22
you need to reduce your time above liquidus to as low as you can...maybe 10~30 secs to allow the solder to wet to the gold but minimise the amount of gold that is dissolved into the solder joint...try also reducing the peak temp to 200~210 deg C. Thi
Electronics Forum | Thu May 21 09:54:07 EDT 1998 | Justin Medernach
| I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and solde
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